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TE Connectivity 2822541-1

Manufacturer: TE Connectivity
Model Number: 2822541-1
Minimum Order Quantity: 1
Packaging Details: SMD
Delivery Time: 1 working day
Stock: 350
Description: Card Connector MICRO SIM Push-Push Surface Mount
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Specifications
Operating Temperature:
-30℃~+85℃
Card Connection Mode:
Push-Push
Height Above Board:
1.27mm
Connector Type:
Connector And Ejector
Card Type:
MicroSIM Card
Product Description

Product Overview

This product is a micro SIM connector with a push-push mechanism, designed for compact electronic devices. It serves as a selection switch and provides a shield ground connection.

Brand Yen-Hen Electronics
Origin Taiwan
Material - Housing Thermoplastic Resin, UL94V-0
Material - Slider Thermoplastic Resin, UL94V-0
Material - Contact Copper Alloy
Material - Shell Stainless Steel
Material - Cam Rod Stainless Steel
Color Black
Finish - Contact Au Plat Contact Area, Au Plat Solder Area
Finish - Shell Au Plat Soldering and Switch Area
Certifications UL94V-0
Part Number Description Pin Name PCB Layout (Reference) - Width (mm) PCB Layout (Reference) - Length (mm) Connector Outline - Width (mm) Connector Outline - Length (mm) Connector Center - Width (mm) Connector Center - Length (mm) Pick & Place Area - Width (mm) Pick & Place Area - Length (mm) Pattern Prohibition Area - Min Width (mm) Pattern Prohibition Area - Max Width (mm) Pattern Prohibition Area - Min Length (mm) Pattern Prohibition Area - Max Length (mm) GND Pad is Permissive
C=2822541 Micro SIM Connector Push-Push DIP 1 SIM 15.1 6 7.55 1.27 9.33 10.05 1.475 1.565 0.815 0.775 0.975 3.97 Yes
C=2822541 Micro SIM Connector Push-Push DIP 2 C2 RST 0 SIM 4.8 6.37 6.32 3.35 3.65 6.02 6.32 Yes
C=2822541 Micro SIM Connector Push-Push DIP 3 C3 2.1 10.255 Yes
C=2822541 Micro SIM Connector Push-Push DIP 4 Shell Ground Yes
Specification Value Unit
Non-cumulative Tolerance 0.1 mm
Coplanarity 0.1 Max
Overall Tolerance 0.1 ~
Switch Moving Area 0.6 Typ.
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