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Quality XKB Connection X5621WV-2x09-C1524D1000 factory
Quality XKB Connection X5621WV-2x09-C1524D1000 factory

XKB Connection X5621WV-2x09-C1524D1000

Manufacturer: XKB Connection
Model Number: X5621WV-2x09-C1524D1000
Minimum Order Quantity: 2000
Packaging Details: DIP-18
Delivery Time: 4-6 weeks
Stock: 20000
Description: 18P DIP Round Hole 15.24mm DIP-18 IC Sockets RoHS
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Specifications
Number Of Positions:
18P
Adaptation Package Type:
DIP
Circular Holes/Square Holes:
Round Hole
Row Spacing:
15.24mm
Product Description

Product Overview

Function: This product is a Pin Header, designed for board-to-board or wire-to-board connections.

Usage: Used in electronic assemblies for signal and power transmission.

Advantages: Offers reliable connection with good mechanical and electrical properties.

Application Scenarios: Suitable for various electronic devices and industrial equipment.

Brand XKB INDUSTRIAL PRECISION CO., LIMITED
Model Type X5621W V-2*XX-C1524 D1000 Series
Part Number X5621WV-2*XX-C1524D1000
Material (Header) PPS UL94V-0
Material (Terminal) Brass
Finish (Terminal) Tin Gold 1u''
Mates With X5621F
Color Black
Certifications UL94V-0
Part Number Description Pitch (mm) Number of Positions Dimensions (A) (mm) Dimensions (B) (mm) Dimensions (C) (mm) Pin Length (D) (mm) Current Rating (Amps) Mechanical Life (Cycles) Contact Resistance (m) Dielectric Strength (V RMS) Operating Temperature (C) Soldering Temperature (C)
X5621WV-2*XX-C1524D1000 Wafer 2.54 2*20 50.80 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 2.54 2*21 53.34 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 2.54 2*24 60.96 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 2.54 2*25 63.50 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
Part Number Description Pitch (mm) Number of Positions Dimensions (A) (mm) Dimensions (B) (mm) Dimensions (C) (mm) Pin Length (D) (mm) Current Rating (Amps) Mechanical Life (Cycles) Contact Resistance (m) Dielectric Strength (V RMS) Operating Temperature (C) Soldering Temperature (C)
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*02 10.16 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*03 15.24 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*04 20.32 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*05 25.40 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*06 30.48 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*07 35.56 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*08 40.64 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*09 45.72 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*10 50.80 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*12 60.96 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*14 71.12 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
X5621WV-2*XX-C1524D1000 Wafer 5.08 2*16 81.28 20.32 15.24 12.20 3 min 500 max 10 min 1000 -40 to +105 +255
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