The Amphenol LTW Z2A1-XXNMAN-BN0001 is a Z-type connector designed for various applications. It features a shielded design and offers a prevention tilt insert structure available for 36 to 40 pin configurations. This connector is suitable for use with Flexible Printed Circuits (FPC) and is RoHS compliant.
General Dimensions:
| Parameter | Value (mm) |
|---|---|
| Overall Length (L) | 25.0 |
| Width (Max) | 26.0 |
| Height (Max) | 6.7 |
| Height (Min) | 3.1 |
FPC Layout Dimensions (Pitch 0.9mm):
| PIN | L(mm) | A(mm) | B(mm) | C(mm) | D(mm) |
|---|---|---|---|---|---|
| 36 | 38.1 | 30.6 | 14.85 | 15.75 | 36.2 |
| 38 | 39.9 | 32.4 | 16.65 | 15.75 | 38.0 |
| 40 | 41.7 | 34.2 | 16.65 | 17.55 | 39.8 |
FPC Layout Dimensions (Pitch 1.8mm):
| PIN | L(mm) | A(mm) | B(mm) | C(mm) | D(mm) |
|---|---|---|---|---|---|
| 18 | 38.1 | 30.6 | 14.85 | 15.75 | 36.2 |
| 19 | 39.9 | 32.4 | 16.65 | 15.75 | 38.0 |
| 20 | 41.7 | 34.2 | 16.65 | 17.55 | 39.8 |
FPC Layout Dimensions (Pitch 2.7mm):
| PIN | L(mm) | F(mm) | A(mm) | B(mm) | C(mm) | D(mm) | E(mm) |
|---|---|---|---|---|---|---|---|
| 12 | 38.1 | 36.2 | 27.0 | 13.05 | 13.95 | 15.75 | 11.25 |
FPC Stack Up:
| Layer | Material | Thickness (mm) |
|---|---|---|
| Top Coverlay | POLYIMIDE | 0.025 |
| ADHESIVE | 0.025 | |
| Base Material | COPPER | 0.035 |
| ADHESIVE | 0.020 | |
| POLYIMIDE | 0.025 | |
| Bottom Stiffener | ADHESIVE | 0.050 |
| FR4 | 0.600 | |
| Total Thickness | 0.75 +0.05 -0.1 |
Tolerances:
Part Numbering Scheme: Z2A1-XXNMAN-BN0001
