Product Name: BM28 Series FPC-to-Board Connectors
Key Features: 0.35mm Pitch, 0.6mm Stacking Height, Supporting Up to 5A current.
Applications: Devices requiring low-profile, compact design such as mobile phones, wearable terminals, and tablet PCs.
Usage Precautions: Includes recommendations for temperature profiles during reflow soldering, manual soldering conditions, metal mask specifications, board warpage limits, and cleaning advice. Emphasizes careful handling during mating/unmating, avoiding PCB support solely by connectors, and securing mated connectors to prevent disengagement.
HIROSE ELECTRIC CO., LTD.
BM28 Series
0.35mm
0.6mm
5A (Power Contact)
Not recommended. Evaluate performance if cleaning is necessary.
| Specification | Details | Conditions |
|---|---|---|
| Operating Temperature | -55 to +85C | |
| Storage Temperature | -10 to +60C | |
| Rated Voltage | 50V AC/DC | |
| Operating Humidity Range | 20-80% | |
| Storage Humidity Range | 40-70% | |
| Contact Resistance (Signal) | 70m Max. | At 20mV AC, 1kHz, 1mA |
| Contact Resistance (Power) | 15m Max. | At 20mV AC, 1kHz, 1mA |
| Insulation Resistance | 1000M Min. | At 100V DC |
| Withstanding Voltage | No flashover or dielectric breakdown | 150V AC for 1 min. |
| Mating Durability (Signal) | 100m Max. | 10 cycles |
| Mating Durability (Power) | 30m Max. | 10 cycles |
| Vibration | No electrical discontinuity for more than 1s | 5-55Hz, half amplitude 0.75mm, 10 cycles in 3 axes |
| Shock Resistance | No electrical discontinuity of 1s or more | 450m/s, 11ms duration, 3 axes |
| Humidity Resistance | Contact Resistance: 70m Max. (Signal), 15m Max. (Power); Insulation Resistance: 100M Min. | 96 hours at 402C, 90-95% RH |
| Temperature Cycle | Contact Resistance: 70m Max. (Signal), 15m Max. (Power); Insulation Resistance: 100M Min. | 5 cycles (-55C to +85C) |
| Solder Heat Resistance | No dissolution or resin melting affecting performance | Reflow: Recommended profile; Hand solder: 350C Max. for 3 sec. |
| Reflow Soldering Profile | Parameter | Value |
|---|---|---|
| Peak Temperature | Maximum | 250C |
| Heating Time | Minimum 220C for | 60 sec. max. |
| Preheating | Temperature | 150 to 180C |
| Preheating | Time | 90 to 120 sec. |
| Reflow Cycles | Maximum | 2 cycles |
| Manual Soldering Conditions | Parameter | Value |
|---|---|---|
| Soldering Iron Temperature | 340 10C | |
| Soldering Time | Within 3 seconds |
| Metal Mask Specifications | Parameter | Value |
|---|---|---|
| Thickness | 0.08mm | |
| Aperture Ratio (Plug Side) | Signal Contact | 100% |
| Aperture Ratio (Plug Side) | Power Contact | 80% |
| Aperture Ratio (Receptacle Side) | 100% |
| Board Warpage | Limit | Location |
|---|---|---|
| Maximum Warpage | 0.02mm | At the center in reference to both ends of the connector |
