This document details the 0.5 Pitch H2.0 Backflip R/A Type Connector, designed for applications requiring a 0.5mm pitch and a 2.0mm height with a right-angle, backflip mechanism. It is suitable for use with specific PCB layouts and flat cables. The product is manufactured by ZHEJIANG WENDA ELECTRONICS CO.,LTD.
| Part Name | Material | Color | Plating | Specifications |
| 0.5(H=2.0) / 0.5 PH Backflip Type Housing (H=2.0) | LCP UL94V-0 | Natural | - | - |
| 0.5(H=2.0) / 0.5 PH Backflip Type Housing (H=2.0) | LCP UL94V-0 | Black | - | - |
| 0.5(H=2.0) / 0.5 PH Backflip Type Terminal (H=2.0) | Copper Alloy | - | Gold Plating | - |
| 0.5(H=2.0) / 0.5 PH Backflip Type Terminal (H=2.0) | Copper Alloy | - | Tin Plating | - |
| 0.5(H=2.0) / 0.5 PH Backflip Type Actuator (H=2.0) | - | - | - | - |
| 0.5(H=2.0) / 0.5 PH Backflip Type Fitting Nail (H=2.0) | - | - | - | - |
| General Technical Specifications: | ||||
| Plastic Surface | Smooth, no rough edges, no obvious shrinkage, defects, cracks. | |||
| Temperature Range | -25C to +85C | |||
| Rated Voltage | 50V AC/DC | |||
| Contact Resistance | 0.03 | |||
| Insulation Resistance | 500M | |||
| Product Material No. | HW0520010** * **** | |||
| No. of Circuits (Product PINs) | Variable (indicated by part number suffix) | |||
| Plating Method Code | 0: Terminal Full Tin, 1: Terminal Full Gold (G/F OVERALL), 2: Terminal Spot Gold | |||
| Packing Method Code | T: TUBE, R: Reel (without cover), C: Reel (with cover) | |||
