The HIROSE FH55/FH55M Series is a 0.4/0.5mm pitch, 1.5mm height, bottom contact, high-speed FPC connector featuring a front flip design. It is engineered for high-speed differential signal transmission up to 16+ Gbps using a GSSG layout and offers impedance-matched contact design for enhanced performance. The fully enclosed molded structure and flip-lock system ensure reliable and secure FPC connections. It is compatible with 0.3mm thick FPC and supports automatic mounting.
| Part Number | Pitch | No. of Pos. | No. of Signal Contacts | No. of Ground Contacts | A (mm) | B (mm) | C (mm) | D (mm) | R (mm) | Purchase Unit |
|---|---|---|---|---|---|---|---|---|---|---|
| FH55-10S-0.5SH | 0.5mm | 10 | 6 | 4 | 8.4 | 4.5 | 5.57 | 7.59 | 0.5 | 5,000pcs per reel |
| FH55-22S-0.5SH | 0.5mm | 22 | 14 | 8 | 14.4 | 10.5 | 11.57 | 13.59 | 0.5 | |
| FH55-31S-0.5SH | 0.5mm | 31 | 20 | 11 | 18.9 | 15.0 | 16.07 | 18.09 | 0.5 | |
| FH55-40S-0.5SH | 0.5mm | 40 | 26 | 14 | 23.4 | 19.5 | 20.57 | 22.59 | 0.5 | |
| FH55-49S-0.5SH | 0.5mm | 49 | 32 | 17 | 27.9 | 24.0 | 25.07 | 27.09 | 0.5 | |
| FH55-61S-0.5SH | 0.5mm | 61 | 40 | 21 | 33.9 | 30.0 | 31.07 | 33.09 | 0.5 | |
| FH55M-10S-0.4SH | 0.4mm | 10 | 6 | 4 | 7.3 | 3.6 | 4.47 | 6.49 | 0.4 | |
| FH55M-19S-0.4SH | 0.4mm | 19 | 12 | 7 | 10.9 | 7.2 | 80.70 | 10.09 | 0.4 | |
| FH55M-31S-0.4SH | 0.4mm | 31 | 20 | 11 | 15.7 | 12.0 | 12.87 | 14.89 | 0.4 | |
| FH55M-40S-0.4SH | 0.4mm | 40 | 26 | 14 | 19.3 | 15.6 | 16.47 | 18.49 | 0.4 | |
| FH55M-49S-0.4SH | 0.4mm | 49 | 32 | 17 | 22.9 | 19.2 | 20.07 | 22.09 | 0.4 | |
| FH55M-61S-0.4SH | 0.4mm | 61 | 40 | 21 | 27.7 | 24.0 | 24.87 | 26.89 | 0.4 | |
| FH55M-79S-0.4SH | 0.4mm | 79 | 52 | 27 | 34.9 | 31.2 | 32.07 | 34.09 | 0.4 |
| Specification | Value |
|---|---|
| Rated Current (0.5mm Pitch) | 0.5A |
| Rated Current (0.4mm Pitch) | 0.4A |
| Operating Temperature | -55 to +85 |
| Operating Humidity Range | RH 90% Max. (No Condensation) |
| Rated Voltage (0.5mm Pitch) | 50Vrms AC |
| Rated Voltage (0.4mm Pitch) | 40Vrms AC |
| Storage Temperature | -10 to +50 |
| Storage Humidity Range | RH 90% Max. (No Condensation) |
| Compatible FPC/FFC Terminal Thickness | t=0.3 0.03 |
| Insulation Resistance | 500M Min. (at 100V DC) |
| Withstanding Voltage (0.5mm pitch) | 150Vrms AC for 1 min. |
| Withstanding Voltage (0.4mm pitch) | 120Vrms AC for 1 min. |
| Contact Resistance | 100m Max. (Includes FPC conductor resistance, at 1mA) |
| Mating Durability | 20 times |
| Vibration Resistance | No electrical discontinuity of 1 s or more |
| Shock Resistance | No electrical discontinuity of 1 s or more |
| Steady-State Moisture Resistance | Contact Resistance100m Max., Insulation Resistance50M Min. (96 hours at +40, 90-95% RH) |
| Temperature Cycle | Contact Resistance100m Max., Insulation Resistance50M Min. (5 cycles) |
| Solder Heat Resistance | No deformation or rattling (Reflow: 250 Max., Soldering iron: 35010) |
| High-Speed Transmission Capability | 16+ Gbps (GSSG layout) |
| Supported Transmission Standards | USB4 Gen.2 (10+Gbps), PCI Express Gen.4 (16+Gbps), HDMI 1.4a Embedded Display-Port 1.3, Serial ATA Gen. 3 |
