This product is a connector designed for FPC (Flexible Printed Circuit) applications, featuring a "One Action Lock" mechanism for simplified FPC insertion and locking. It is suitable for use in electronic equipment and devices, with specific considerations for high-reliability applications.
| Item | Test Method | Requirements | QT | AT |
| APPLICABLE STANDARD | ||||
| Operating temperature range | -55 C to 85 C | |||
| Storage temperature range (Packed condition) | -10 C TO 50 C | |||
| Relative humidity (Operating or storage) | 90 % MAX (Not dewed) | |||
| Voltage Rating | 30V AC / DC | |||
| Current Rating | 0.3 A | |||
| Applicable cable | t=0.30.03mm, Gold plating | |||
| SPECIFICATIONS | ||||
| CONSTRUCTION | ||||
| General examination | Visually and by measuring instrument. According to drawing. (note 1) | |||
| Marking | Confirmed visually. | |||
| ELECTRICAL CHARACTERISTICS | ||||
| Voltage proof | 90 V AC for 1 min. No flashover or breakdown. | |||
| Insulation resistance | 100 V DC. | 50 M MIN. | ||
| Contact resistance | AC 20 mV MAX , 1 mA . | 100 m MAX. Including FPC bulk resistance (L=8mm) | ||
| MECHANICAL CHARACTERISTICS | ||||
| Vibration | Frequency 10 to 55 Hz, half amplitude 0.75 mm, for 10 cycles in 3 axial directions. | No electrical discontinuity of 1 s. Contact resistance: 100 m MAX. No damage, crack and looseness of parts. | ||
| Shock | 981 m/s2 , duration of pulse 6 ms at 3 times in 3 both axial directions. | |||
| Mechanical operation | 10 times insertions and extractions. | Contact resistance: 100 m MAX. No damage, crack and looseness of parts. | ||
| FPC insertion force | Measured by applicable FPC (Thickness of FPC shall be t=0.30mm at initial condition.) | Insertion forceDirection of insertion 2.6+0.14n N MAX (note 2) (n: Number of contacts) | ||
| FPC retention force | Measured by applicable FPC (Thickness of FPC shall be t=0.30mm at initial condition.) | Retention forceDirection of extraction 5+0.07n N MIN (note3) (n: Number of contacts) | ||
| ENVIRONMENTAL CHARACTERISTICS | ||||
| Corrosion salt mist | Exposed at 352 , 5 % salt water spray for 96 h. | Contact resistance: 100 m MAX. | ||
| Rapid change of temperature | Temperature-55+15TO+35+85+15TO+35C Time 30 2 to 3 30 2 to 3 min Under 5 cycles. | Contact resistance: 100 m MAX. Insulation resistance: 50 M MIN. No damage, crack and looseness of parts. | ||
| Damp heat (steady state) | Exposed at 402 C, Relative humidity 90 to 95 %, 96 h. | |||
| Damp heat, cyclic | Exposed at -10 to +65 c, Relative humidity 90 to 96 %, 10 cycles, TOTAL 240 h. | Contact resistance: 100 m MAX. Insulation resistance: 1 M MIN. (At high humidity) Insulation resistance: 50 M MIN. (At dry) No damage, crack and looseness of parts | ||
| Dry heat | Exposed at 852, 96 h. | Contact resistance: 100 m MAX. No damage, crack and looseness of parts | ||
| Cold | Exposed at -553, 96 h. | |||
| Sulphur dioxide [JIS C 60068-2-42] | Exposed at 402 C, Relative humidity 805% 255 ppm for 96 h. | Contact resistance: 100 m MAX. | ||
| Hydrogen sulphide [JIS C 60068-2-43] | Exposed at 402 C, Relative humidity 805% , 10 to 15 ppm for 96 h. | |||
| Solderability | Soldered at solder temperature, 2453 for immersion duration,30.3 sec. | A new uniform coating of solder shall cover a minimum of 95 % of the surface being immersed. | ||
| Resistance to soldering heat | 1) Reflow soldering : Peak TMP. 250 C MAX . Reflow TMP. over 220 C 60 to 90 sec. Number of reflow : 2 times 2) Soldering irons : TMP. 35010 C for 51 sec . | No deformation of case of excessive looseness of the terminals. (note 4) |
