This specification covers the NANO SIM card socket connector. It is designed for reliable performance in various applications requiring SIM card connectivity.
Used for inserting and connecting NANO SIM cards in electronic devices. Suitable for mobile phones, tablets, IoT devices, and other communication modules.
| Part Number | Description | Housing Material | Contact Material | Shell Material | Contact Finish | Rating Current (Max) | Contact Resistance (Max) | Dielectric Withstanding Voltage (Min) | Insulation Resistance (Min) | Mating Cycles (Min) | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|
| NOS11-S1F1-2000-A / NOS21-S1F1-2000-A | NANO SIM Card Socket | LCP S475 UL 94V-0 | C5191 | SUS304-H | Gold Flash Plated on Contact Area & Solder Tails | 0.5 A | 50 m | 500 V AC | 1000 M | 3000 Cycles | -20C to +65C |
| Test Item | Requirement | Procedure |
|---|---|---|
| Contact Resistance | 50 m Max (Initial) / 100 m Max (Final) | EIA-364-23A |
| Dielectric Withstanding Voltage | 500 VAC for 1 minute (0.5 mA MAX current leakage) | EIA-364-20A |
| Insulation Resistance | 100 M Min. (at 250 VDC) | EIA-364-21A |
| Vibration | No damage, Current discontinuity 10 s, Contact Resistance 100m | EIA-364-28A |
| Mechanical Shock | No damage, Discontinuity: 10s MAX, Contact Resistance100m | EIA-364-28A |
| Durability | No damage, Contact Resistance 100m | EIA-RS-364-09A (3000 Cycles) |
| Contact Normal Force | 40gf /pin Min. (Initial), 25~35gf /pin Min. (After durability) | Tensile force test |
| Contact Retention Force | 50gf /pin Min. | Tensile strength tester |
| Humidity Test (Steady state) | No damage, Contact resistance 100 m, Insulation Resistance 1000 M | EIA-RS-364-31A (402, 90~95% RH for 96 hours) |
| Thermal Shock | No damage, Contact resistance 100 m, Insulation Resistance 1000 M | EIA-364-32C (5 cycles: -55C to +85C) |
| Temperature Life | No damage, Contact resistance 100 m, Insulation Resistance 1000 M | 85C for 96 hours |
| Solderability | No damage, 95% Min. coverage | EIA-RS-364-52 (245 5 for 10 0.5 seconds) |
| Salt Spray | No detrimental corrosion, Contact resistance 100 m | EIA-RS-364-26A (5% salt water, 352 for 16 hours) |
| Resistance to soldering heat | No evidence of physical damage | Reflow soldering conditions |
| Test Group | Test Items | Sample Quantity (pcs) |
|---|---|---|
| A | 1, 5 | 5 |
| B | 1, 5 | 5 |
| C | 1, 5 | 5 |
| D | 1, 8 | 5 |
| E | 1, 7 | 5 |
| F | 1, 6 | 5 |
| G | 1, 4 | 5 |
| H | 1, 3 | 5 |
| I | 2, 4 | 5 |
| J | 2, 6 | 5 |
| K | 2, 5 | 5 |
