This specification covers the NANO SIM card socket connector. It is designed for use with SIM cards and provides reliable connectivity.
This connector is suitable for various electronic devices requiring NANO SIM card connectivity, including mobile devices, IoT modules, and other communication equipment.
| Part No. | Description | Material - Housing | Material - Contact | Material - Shell | Finish - Contact | Rating Current (Max.) | Contact Resistance (Max.) | Dielectric Withstanding Voltage (Min.) | Insulation Resistance (Min.) | Mating Cycles | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|
| NOS11-S1F1-2000-A / NOS21-S1F1-2000-A | NANO SIM Card Socket | LCP S475 UL 94V-0 | C5191 | SUS304-H | Gold Flash Plated on Contact Area; Gold Flash Plated on Solder Tails | 0.5A | 50 m | 500V AC | 1000 M | 3000 Cycles | -20C to +65C |
| Test Item | Requirement | Procedure |
|---|---|---|
| Contact Resistance | 50 m Max (Initial) / 100 m Max (Final) | EIA-364-23A |
| Dielectric Withstanding Voltage | 500 VAC for 1 minute (0.5 mA MAX current leakage) | EIA-364-20A |
| Insulation Resistance | 100 M Min. (250 VDC impressed voltage) | EIA-364-21A |
| Vibration | No physical damage; Current discontinuity 10 s; Contact Resistance 100m | EIA-364-28A |
| Mechanical Shock | No damage, loose part nor crack; Discontinuity: 10s MAX; Contact Resistance 100m | EIA-364-28A (Modified for Shock) |
| Durability | No physical damage; Contact Resistance 100m | EIA-RS-364-09A (3000 Cycles) |
| Contact Normal Force | 40gf /pin Min. (Initial); 25~35gf /pin Min. (After durability) | Tensile force test equipment |
| Contact Retention Force | 50gf /pin Min. | Tensile strength tester |
| Humidity Test (Steady state) | No physical damage; Contact resistance 100 m; Insulation Resistance 1000 M | EIA-RS-364-31A (402, 90~95% RH for 96 hours) |
| Thermal Shock | No physical damage; Contact resistance 100 m; Insulation Resistance 1000 M | EIA-364-32C (5 cycles: -55 to +85) |
| Temperature Life | No physical damage; Contact resistance 100 m; Insulation Resistance 1000 M | 85+2 for 96 hours |
| Solderability | No physical damage; Coverage 95% Min. | EIA-RS-364-52 (245 5 for 10 0.5 seconds) |
| Salt Spray | No detrimental corrosion; Contact resistance 100 m | EIA-RS-364-26A (5% Salt water, 352 for 16 hours) |
| Resistance to Soldering Heat | No physical damage | Reflow soldering conditions (Fig 1) |
