Function: This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company. ( T-FLASH .)
Usage/Application: T-Flash (TF) card connector for external soldering.
Advantages: Complies with RoHS directive. Designed to meet electrical, mechanical, and environmental performance requirements.
| Item | Requirements | Test Methods | Initial | After Test | Max. | Min. | Condition | Voltage | Current | Time |
|---|---|---|---|---|---|---|---|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. | ||||||||
| Contact resistance (Low Level) | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. | 80 m | 100 m | 20 mV | 10 mA | |||||
| Insulation resistance | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B | 1000 M | Condition B | 500 V DC | ||||||
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. | 1.0 mA | 1 minute | 500 V AC | 1 minute | ||||
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate c` |
