This document outlines the material, finish, electrical, machinery, and environmental specifications for a TF CARD CONNECTOR (Model: XKTF-005).
LCP UL94V0
BLACK
C2680
C2680
G/F plated on contact area; 60u" MIN Tin plated on solder area; Ni 30u" MIN. underplated overall.
Ni 30u" MIN. plated overall
| Parameter | Value | Unit |
|---|---|---|
| Rated Current | 0.54 | A |
| Contact Resistance | 100 | m MAX |
| Insulation Resistance | 1000 | M MIN |
| Dielectric Withstanding Voltage | 100 | V AC RMS |
| Mating Force | 1~10 | N |
| Unmating Force | 1~10 | N |
| Durability | 5000 | Cycles MIN |
| Operating Temperature | -40 to +85 | C |
| Operating Humidity | 80 | % R.H MAX |
| Salt Spray | 24 | H |
| Solder Ability | 245C, 5 | s |
| IR Reflow Peak Temperature | 260 | C (maintained for 10 seconds) |
