Function: This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company.
Usage: External welding TF card connector.
Application Scenarios: Electronics requiring TF card connectivity.
| Item | Requirements | Test Methods | Initial | After Durability | After Environmental |
|---|---|---|---|---|---|
| Contact resistance (Low Level) | 80 m Max. | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. | 80 m | - | - |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). | 1000 M | - | - |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. | Current l` |
