This connector is designed for SD Card & MMC (Multi media card), complying with the SD Card Association standard. It features switches for Write-protection and Card-detection. The Push-push mechanism allows for easy card ejection. It offers a space-saving design, controlled card ejection, outstanding durability, and prevention of reverse card insertion.
SD Card & MMC (Multi media card) storage solutions.
JST
SDK-9BNS-K13-GS-TB
Embossed tape (450 Q'ty / reel)
RoHS compliant (displays (LF)(SN) on label)
Heat resisting resin, UL94V-0
Copper alloy, nickel-undercoated, selective gold-plated, selective tin-plated (reflow treatment)
Copper alloy, nickel-undercoated, gold-plated
Copper alloy, nickel-undercoated, gold-plated
Copper alloy, nickel-undercoated, selective gold-plated, selective tin-plated (reflow treatment)
Copper alloy, tin-plated
SUS
SUS, Solder tail/ selective nickel-undercoated, tin-plated (reflow treatment)
| Specification | Value | Condition |
|---|---|---|
| Current Rating | 0.5A | AC, DC |
| Voltage Rating | 5V | AC, DC |
| Temperature Range | -25C to +85C | (including temperature rise in applying electrical current) |
| Recommendatory PC Board Thickness | 0.6mm to 1.0mm | [When it is mounted on the FPC, recommendable reinforcing layer thickness is 0.6mm min.] |
| Contact Resistance (Signal part) | 30m max. | Initial value |
| Contact Resistance (Signal part) | 60m max. | After environmental testing |
| Contact Resistance (Switch part) | 100m max. | Initial value |
| Contact Resistance (Switch part) | 100m max. | After environmental testing |
| Insulation Resistance | 1,000M min. | at 500V DC |
| Withstanding Voltage | 500V AC/minute |
