This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH CARD CONN., which is designed and manufactured by Compeny. This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH CARD CONN., which is designed and manufactured by Compeny. T-FLASH CARD.
| Item | Requirements | Test Methods |
|---|---|---|
| 1. Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| 2. Contact resistance (Low Level) | 80 m Max. initial 80 m . | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. 10mA 20 mV max. |
| 3. Insulation resistance | 1000 M Min. 1000 M | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). MIL-STD-202, 302 B (500V DC10%) |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.. 500V AC 1.0 mA. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. MIL-STD-202 301 |
| 5. Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing 100 m | Mate and unmate connector for 5000 cycle . 5000 |
| 6. Temperature rise | 30C Max. 30C | Carry rated current load.0.3A per contact. UL4980.3A UL498 |
| 7. Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then 1 sec (s) shall occur. Contact resistance:100 mmax. 1 sec (s) 100 m | Subj |
| TABLE I: PERFORMANCE REQUIREMENTS | ||
|---|---|---|
| Items | Requirements | Test Methods |
| 1.Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| 2. Contact resistance (Low Level) | 80 m Max. initial 80 m . | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. 10mA 20 mV max. |
| 3. Insulation resistance | 1000 M Min. 1000 M | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). MIL-STD-202, 302 B (500V DC10%) |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.. 500V AC 1.0 mA. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. MIL-STD-202 301 |
| 5. Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing 100 m | Mate and unmate connector for 5000 cycle . 5000 |
| 6. Temperature rise | 30C Max. 30C | Carry rated current load.0.3A per contact. UL4980.3A UL498 |
| 7.Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then 1 sec (s) shall occur. Contact resistance:100 mmax. 1 sec (s) 100 m | Subj |
| TABLE II: PRODUCT QUALIFICATION TEST SEQUENCE | ||
|---|---|---|
| Items | Requirements | Test Methods |
| TABLE III: REFLOW SOLDERING PROFILE | ||
|---|---|---|
| Items | Requirements | Test Methods |
