This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors provide space savings and improved functionality for system signal transfer.
| Specification | Description | Requirement | Test Condition | Standard |
|---|---|---|---|---|
| Materials - Contact | High performance copper alloy (Phosphor Bronze) | |||
| Finish - Contact Area | Gold over Nickel | |||
| Finish - Solder Tail Area | Gold over Nickel | |||
| Materials - Housing | LCP+30%G.F, UL94V-0 | |||
| Voltage Rating | 500 Volts DC, 250 Volts AC(rms) (per pin) | |||
| Current Rating | 0.5 Amperes DC (per pin) | |||
| Operating Temperature | -25 TO +85 | |||
| Low-Signal Level Contact Resistance | R<100 m | <100 m | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Insulation Resistance | R>1000 M | >1000 M | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 V final for 1 minute. | MIL-STD-202F, Method 301 | |
| Retention Force | 100 Gram (0.98N) minimum (per pin) | 100 Gram (0.98N) minimum | Mate connector with a suitable gauge for each pin at rate of 25 mm/min. | MIL-STD-1344A, Method 2012.1 |
| Vibration | Discontinuity 1.0 microsec. MAX | 1.0 microsec. MAX | Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz (traversed in 1 minute). | MIL-STD-202 Method 201 |
| Durability | 5000 cycles | 5000 cycles | The sample should be mounted in the tester at a rate of 25mm/min. | MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Minimum of 95% solder coverage | Subject test area to flux for 30.5 seconds and then into solder bath at 2705 for 30.5 seconds. | |
| Salt Spray | Oxidation of not more than 5% | Not more than 5% oxidation | Subject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours. | MTL-STD-1344A, Method 1001.1 |
| Temperature Life (Heat Aging) | A. Products in 85 2 for 96 hours, can still be used normally. B. Products in 260 5 or over eight reflow temperature cycles (max 260 ), deformation not more than 0.12 mm. | A. Normal use after 96 hours at 852. B. Deformation < 0.12 mm after reflow. | MTL-STD-202F, Method 108A |
