86--13264592152

SHETIME SMP11-S1S1-2000-A

Brand Name: SMP11-S1S1-2000-A
Model Number: SMP11-S1S1-2000-A
Minimum Order Quantity: 500
Packaging Details: SMD
Delivery Time: 3-5工作日
Stock: 50000
Description: -25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS
Inquiry Now
Get A Quote
Specifications
Operating Temperature:
-25℃~+85℃
Card Connection Mode:
Push-Push
Height Above Board:
1.9mm
Product Description

Product Overview

Function: SIM Memory Card Connector designed for performance, tests, and quality requirements. Provides space savings and improved functionality for system signal transfer.

Usage: Primarily used in systems requiring SIM card connectivity, offering efficient signal transfer.

Advantages: Space-saving design, improved functionality.

Application Scenarios: Systems requiring SIM card interfaces.

BrandGYUEDA
Part NumberSMP11-S1S1-2000-A
OriginTAIWAN (Factory), CHINA (Factory)
Customer Part NumberSIM1.9

Technical Specifications

SpecificationDescriptionValueTest Method
Materials - ContactHigh performance copper alloy (Phosphor Bronze)--
Materials - Contact Finish(a) Contact Area: Gold over Nickel
(b) Solder Tail area: Gold over Nickel
--
Materials - HousingLCP+30%G.F, UL94V-0--
Ratings - Voltage500 Volts DC, 250 Volts AC(rms) (per pin)--
Ratings - Current0.5 Amperes DC (per pin)--
Ratings - Operating Temperature-25 TO +85--
ELECTRICAL - Low-Signal Level Contact ResistanceR<100 m<100 mMIL-STD-202F, Method 302
ELECTRICAL - Insulation ResistanceR>1000 M>1000 MMIL-STD-202F, Method 302
ELECTRICAL - Dielectric Withstanding VoltageNo discharge, flashover or breakdown.500 V initial and 250 V final for 1 minuteMIL-STD-202F, Method 301
MECHANICAL - Retention Force100 Gram(0.98N) minimum (per pin) 100 g (0.98 N)MIL-STD-1344A, Method 2012.1
MECHANICAL - VibrationDiscontinuity 1.0 microsec. MAX1.0 s MAXMIL-STD-202 Method 201 (Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz for 2 hours in each of 3 axes)
MECHANICAL - Durability5000 cycles 5000 cyclesMIL-STD-1344A, Method 2016
SolderabilitySolderable area shall have minimum of 95% solder coverage. 95%Bath at 2705 for 30.5 seconds
ENVIRONMENTAL - Salt SprayOxidation of not more than 5% 5% oxidation352 for 24 hours (MIL-STD-1344A, Method 1001.1)
ENVIRONMENTAL - Temperature Life (Heat Aging)A. Products in 852 96 hours, the product can still be used normally.
B. Products in 2605 or eight of the reflow temperature (maximum temperature of 260), the deformation of not more than 0.08 mm.
A. Normal use at 852 for 96h.
B. Deformation 0.08 mm at 2605 (max reflow temp)
MIL-STD-202F, Method 108A
Related Products
Send An Inquiry