This high-density, small form factor backplane system offers a modular design for significant space-savings and flexibility. It provides high performance with up to 84 differential pairs per linear inch and supports 3, 4, and 6-pair designs across 4, 6, and 8 columns. Integrated power, guidance, keying, and side walls are available, along with 85 and 100 impedance options. Configurations can be customized by combining modules to create integrated receptacles (BSP Series), with corresponding terminal modules mounted to the backplane. Press-fit tooling options are also available.
| Series | Description | Pitch | Pairs per Linear Inch | Pairs per Column | No. of Columns | Impedance | Current Rating | Voltage Rating | Operating Temp Range |
|---|---|---|---|---|---|---|---|---|---|
| XCede HD | High-Density Backplane Headers & Sockets | (1.80 mm) .071" | Up to 84 | 3, 4, 6 | 4, 6, 8 | 85 , 100 | 1.5 A per contact (HDTM), 10 A per blade (HPTS) | 48 VAC | -40 C to +105 C |
| BSP Series | Integrated Receptacle System | (1.80 mm) .071" | Up to 84 | 3, 4, 6 | 4, 6, 8 | 85 , 100 | Not specified | Not specified | Not specified |
| HDTM/HDTF | High-Density Backplane Receptacles & Terminals | (1.80 mm) .071" | Up to 84 | 3, 4, 6 | 4, 6, 8 | 85 , 100 | 1.5 A per contact (HDTM) | 48 VAC | -40 C to +105 C |
| HPTS/HPTT | Power Modules | (3.20 mm) .126" | Not specified | Not specified | Not specified | Not specified | 10 A per blade (HPTS) | 48 VAC | -40 C to +105 C |
