This 1.25mm pitch wire-to-board header is designed for high-density interconnect applications. It features a right-angle, SMD-type configuration, making it ideal for compact PCB layouts where space is limited. The header is constructed with a high-temperature thermoplastic insulator and copper alloy contacts, ensuring durability and reliability in various electronic environments.
| Specification | Value |
|---|---|
| Operating Voltage | 100 VAC/DC |
| Current Rating | 1.0 A AC/DC (with AWG #28) |
| Contact Resistance | 20 mohms max |
| Insulation Resistance | 500 Mohms min |
| Dielectric Withstanding Voltage | 500 VAC for 1 minute |
| Operating Temperature | -25C to +85C |
