The PH Connector is a thin, low-profile 2.0 mm pitch connector designed for high-density internal wire-to-printed circuit board connections. It measures 8.0 mm in height after mounting and 4.5 mm in width. Key advantages include its compact size, high reliability, and low cost. It features a reliable contact system, fully shrouded header, and a printed circuit board retention mechanism. A surface mount model (SMT) is also available.
| Product Type | No. of Circuits | Model No. | Dimensions (mm) A | Dimensions (mm) B | Q'ty/box or Q'ty/reel or Q'ty/bag | Material and Finish |
|---|---|---|---|---|---|---|
| Contact | 2-16 | SPH-002T-P0.5S | - | - | 8,000 (Q'ty/reel) | Phosphor bronze, tin-plated (reow treatment) |
| Contact | 2-16 | SPH-002T-P0.5L | - | - | 10,000 (Q'ty/reel) | Phosphor bronze, tin-plated (reow treatment) |
| Contact | 2-16 | SPH-004T-P0.5S | - | - | 8,000 (Q'ty/reel) | Phosphor bronze, tin-plated (reow treatment) |
| Contact Housing | 2-16 | S2B-PH-K-S | 2.0 | 5.9 | 1,000 (Q'ty/box) | Wafer: PA 66, UL94V-0, natural (white) |
| Contact Housing | 2-16 | S16B-PH-K-S | 30.0 | 33.9 | 250 (Q'ty/box) | Wafer: PA 66, UL94V-0, natural (white) |
| Contact Housing | 2-16 | B2B-PH-K-S | 2.0 | 5.9 | 1,000 (Q'ty/box) | Wafer: PA 66, UL94V-0, natural (white) |
| Contact Housing | 2-16 | B16B-PH-K-S | 30.0 | 33.9 | 200 (Q'ty/box) | Wafer: PA 66, UL94V-0, natural (white) |
| Contact Housing | 2-16 | PHR-2 | 2.0 | 5.8 | 2,000 (Q'ty/bag) | PA 66, UL94V-0, natural (white) |
| Contact Housing | 2-16 | PHR-16 | 30.0 | 33.8 | 1,000 (Q'ty/bag) | PA 66, UL94V-0, natural (white) |
| Header (SMT type) | 2-16 | B2B-PH-SM4-TB | 2.0 | 7.95 | 1,000 (Q'ty/reel) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA, UL94V-0, natural (ivory) |
| Header (SMT type) | 2-16 | B16B-PH-SM4-TB | 30.0 | 35.95 | 1,000 (Q'ty/reel) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA, UL94V-0, natural (ivory) |
| Header (SMT type) | 2-16 | S2B-PH-SM4-TB | 2.0 | 7.9 | 1,000 (Q'ty/reel) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA, UL94V-0, natural (ivory) |
| Header (SMT type) | 2-16 | S15B-PH-SM4-TB | 28.0 | 33.9 | 1,000 (Q'ty/reel) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA, UL94V-0, natural (ivory) |
| Header (Low insertion force type) | 2-16 | S2B-PH-KL | 2.0 | 5.9 | 1,000 (Q'ty/box) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA 66, UL94V-0, gray |
| Header (Low insertion force type) | 2-16 | S16B-PH-KL | 30.0 | 33.9 | 200 (Q'ty/box) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA 66, UL94V-0, gray |
| Header (Low insertion force type) | 2-16 | B2B-PH-KL | 2.0 | 5.9 | 1,000 (Q'ty/box) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA 66, UL94V-0, gray |
| Header (Low insertion force type) | 2-16 | B16B-PH-KL | 30.0 | 33.9 | 200 (Q'ty/box) | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment); Wafer: PA 66, UL94V-0, gray |
| Specification | Value |
|---|---|
| Current Rating | 2 A AC/DC (AWG #24) |
| Voltage Rating | 100 V AC/DC |
| Temperature Range | -25 to +85 (including temperature rise in applying electrical current) |
| Contact Resistance (Initial) | 10 m max. |
| Contact Resistance (After environmental tests) | 20 m max. |
| Insulation Resistance | 1,000 M min. |
| Withstanding Voltage | 800 VAC/ minute |
| Applicable Wire | AWG #32 to #24 |
| Applicable PC board thickness | 0.8 to 1.6 mm |
