This is a thin, low-profile 2.0 mm pitch connector, 8.0 mm in height after mounting and 4.5 mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in surface mount (SMT) models.
| Type | No. of Circuits | Model No. | Dimensions (mm) A | Dimensions (mm) B | Q'ty/box or Q'ty/bag or Q'ty/reel | Material and Finish |
| Contact | 2-16 | PHR-2 to PHR-16 | 2.0 to 30.0 | 5.8 to 33.8 | 2,000 to 1,000 | Phosphor bronze, tin-plated (reow treatment) |
| Housing (Top entry type) | 2-16 | S2B-PH-K-S to S16B-PH-K-S | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 to 250 | Post: Brass, copper-undercoated, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, natural (white) |
| Housing (Side entry type) | 2-16 | B2B-PH-K-S to B16B-PH-K-S | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 to 250 | Post: Brass, copper-undercoated, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, natural (white) |
| Contact (SMT type) | - | SPH-002T-P0.5S, SPH-002T-P0.5L, SPH-004T-P0.5S | - | - | 8,000 to 10,000 | Phosphor bronze, tin-plated (reow treatment) |
| Header (Top entry type) | 2-16 | B2B-PH-SM4-TB to B16B-PH-SM4-TB | 2.0 to 30.0 | 7.95 to 35.95 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reow treatment) |
| Header (Side entry type) | 2-16 | S2B-PH-SM4-TB to S15B-PH-SM4-TB | 2.0 to 30.0 | 7.9 to 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reow treatment) |
| Header (Low insertion force type) | 2-16 | S2B-PH-KL to S16B-PH-KL | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 to 250 | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, gray |
| Header (Low insertion force type, Top entry) | 2-16 | B2B-PH-KL to B16B-PH-KL | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 to 250 | Post: Copper alloy, copper-undercoated, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, gray |
| Specification | Value |
| Pitch | 2.0 mm |
| Current Rating | 2 A AC/DC (AWG #24) |
| Voltage Rating | 100 V AC/DC |
| Temperature Range | -25 to +85 |
| Contact Resistance | Initial value/ 10 m max., After environmental tests/ 20 m max. |
| Insulation Resistance | 1,000 M min. |
| Withstanding Voltage | 800 VAC/ minute |
| Applicable Wire | AWG #32 to #24 |
| Applicable PC board thickness | 0.8 to 1.6 mm |
