This is a thin, low-profile 2.0 mm pitch connector, 8.0 mm in height after mounting and 4.5 mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in surface mount (SMT) and through-hole types.
| Component Type | Model No. | No. of Circuits | Dimensions (mm) A | Dimensions (mm) B | Material and Finish | Q'ty/Box or Bag or Reel | Applicable Wire Range | Insulation O.D. (mm) |
| Contact | SPH-002T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reow treatment) | 8,000/reel | AWG #30 to #24 (0.05 to 0.22 mm) | 0.8 to 1.5 |
| Contact | SPH-002T-P0.5L | - | - | - | Phosphor bronze, tin-plated (reow treatment) | 10,000/reel | AWG #28 to #24 (0.08 to 0.22 mm) | 0.8 to 1.5 |
| Contact | SPH-004T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reow treatment) | 8,000/reel | AWG #32 to #28 (0.032 to 0.08 mm) | 0.5 to 0.9 |
| Housing | S2B-PH-K-S | 2 | 2.0 | 5.9 | Wafer: PA 66, UL94V-0, natural (white) | 1,000/box | - | - |
| Housing | S16B-PH-K-S | 16 | 30.0 | 33.9 | Wafer: PA 66, UL94V-0, natural (white) | 250/box | - | - |
| Housing | B2B-PH-K-S | 2 | 2.0 | 5.9 | Wafer: PA 66, UL94V-0, natural (white) | 1,000/box | - | - |
| Housing | B16B-PH-K-S | 16 | 30.0 | 33.9 | Wafer: PA 66, UL94V-0, natural (white) | 200/box | - | - |
| Housing | PHR-2 | 2 | 2.0 | 5.8 | PA 66, UL94V-0, natural (white) | 2,000/bag | - | - |
| Housing | PHR-16 | 16 | 30.0 | 33.8 | PA 66, UL94V-0, natural (white) | 1,000/bag | - | - |
| Header (SMT type) | B2B-PH-SM4-TB | 2 | 2.0 | 7.95 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, tin-plated (reow treatment) | 1,000/reel | - | - |
| Header (SMT type) | B16B-PH-SM4-TB | 16 | 30.0 | 35.95 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, tin-plated (reow treatment) | 1,000/reel | - | - |
| Header (SMT type) | S2B-PH-SM4-TB | 2 | 2.0 | 7.9 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, tin-plated (reow treatment) | 1,000/reel | - | - |
| Header (SMT type) | S15B-PH-SM4-TB | 15 | 28.0 | 33.9 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, tin-plated (reow treatment) | 1,000/reel | - | - |
| Header (Low insertion force type) | B2B-PH-KL | 2 | 2.0 | 5.9 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, gray | 1,000/box | - | - |
| Header (Low insertion force type) | B16B-PH-KL | 16 | 30.0 | 33.9 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, gray | 200/box | - | - |
| Header (Low insertion force type) | S2B-PH-KL | 2 | 2.0 | 5.9 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, gray | 1,000/box | - | - |
| Header (Low insertion force type) | S15B-PH-KL | 15 | 28.0 | 33.9 | Post: Copper alloy, tin-plated (reow treatment) Wafer: PA 66, UL94V-0, gray | 250/box | - | - |
| Specification | Value |
| Current Rating | 2 A AC/DC (AWG #24) |
| Voltage Rating | 100 V AC/DC |
| Temperature Range | -25 to +85 |
| Contact Resistance | Initial value/ 10 m max. After environmental tests/ 20 m max. |
| Insulation Resistance | 1,000 M min. |
| Withstanding Voltage | 800 VAC/ minute |
| Applicable PC board thickness | 0.8 to 1.6 mm |
