ITT Cannon offers a comprehensive portfolio of high-performance microminiature interconnect solutions designed for demanding applications. These ultra-lightweight, space-saving connectors and cable assemblies provide unmatched performance and reliability in the harshest environments. They are ideal for markets and applications requiring extremely small, lightweight, and reliable interconnects, featuring higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. Key benefits include an ultra-small, lightweight, high-performance form factor, exceptional bandwidth, durability for high shock and vibration, unique mechanical engagement and locking mechanisms, custom & turnkey cable assemblies, and RoHS compliant options.
| Product Line | Contact Spacing | Positions | Wire Size | Current Rating | Durability | Operating Temperature |
|---|---|---|---|---|---|---|
| MDM Micro-D (MIL-DTL-83513) | .050 | 9, 15, 21, 25, 31, 37, 51, 69, 100 | AWG 24 thru AWG 32 | 3A | 500 mating cycles | MDM Standard: -55C to +150C High Temp MDM (F222): -55C to +200C Ultra-High Temp MDM (F300): -55C to +230C |
| MDM PCB (MIL-DTL-83513) | .050 | 9, 15, 21, 25, 31, 37, 51, 69, 100 | AWG 24 thru AWG 32 | 3A | 500 mating cycles | MDM Standard: -55C to +150C High Temp MDM (F222): -55C to +200C Ultra-High Temp MDM (F300): -55C to +230C |
| MDLM Micro-D Metal Shell, Low Profile | .050 | 9, 15, 21, 25, 31, 37, 51, 69, 100 | AWG 24 thru AWG 32 | 3A | 500 mating cycles | Standard & F222: -55C to +200C |
| MDM F300 Ultra-High Temp Micro | .050 | 9, 15, 21, 25, 31, 37, 51, 69, 100 | AWG 24 thru AWG 32 | 3A | 500 mating cycles | -55C to +230C |
| MIK Micro Circular | .050 | 9, 15, 21, 25, 31, 37, 51, 69, 100 | AWG 24 thru AWG 32 | 3A | 500 mating cycles | -55C to +150C |
| MT* Strip-Style | .050 | 9, 15, 21, 25, 31, 37, 51, 69, 100 | AWG 24 thru AWG 32 | 3A | 500 mating cycles | -55C to +150C |
