The 3M CP2 Press-Fit Socket is designed for high signal density at a low cost, utilizing a 2 mm grid spacing. It features an "Eye of the Needle" compliant pin press-fit design to reduce manufacturing time and cost. An additional grounding row is available for improved ground bounce and EMI immunity. This module mates with 5-row 3M HM and CP2 Headers and is end-to-end stackable with various 5-row 3M sockets.
This module is not suitable for stand-alone use. Refer to IEC-61076-4-101.
3M
CP2 Series
Signal Contacts, Press-Fit Socket
2 mm
Right Angle
IEC 61076-4-101, IEC 60352-5
High Temperature Thermoplastic (LCP)
UL94V-0
Copper Alloy
200 for KR plating
-55C to +125C
| Part Number Component | Signal Contact Quantity | Dimension A (mm) | Dimension B (mm) | Shield Options | Plating Options |
|---|---|---|---|---|---|
| CP2-SBXXX-X1-XXXX | 95 | 38.00 | 36.00 | G (Upper Shield) / Blank (No Shield) | FJ (Gold/Matte Tin/Nickel) / KR (Gold/Matte Tin/Nickel) |
| CP2-SBXXX-X1-XXXX | 110 | 44.00 | 42.00 | G (Upper Shield) / Blank (No Shield) | FJ (Gold/Matte Tin/Nickel) / KR (Gold/Matte Tin/Nickel) |
| CP2-SBXXX-X1-XXXX | 125 | 50.00 | 48.00 | G (Upper Shield) / Blank (No Shield) | FJ (Gold/Matte Tin/Nickel) / KR (Gold/Matte Tin/Nickel) |
| Specification | Value |
|---|---|
| Current Rating | 1.0 Amperes at 70C (all contacts powered) |
| Contact Resistance | 20 m |
| Insulation Resistance | 10,000 M |
| Test Voltage | 750 VACRMS |
| Mating Force | 0.75 N/PIN |
| Withdrawal Force | 0.15 N/PIN |
| PCB Specification | Parameter | Value |
|---|---|---|
| PCB Data | Recommended PCB Plated Through Hole Diameter | 0.60.05 mm |
| PCB Data | Drill Hole Diameter | 0.70.02 mm |
| PCB Data | Hole Platings | Cu 25~50 m, Sn<10 m |
| PCB Data | PCB Thickness | 1.4 - 4.2 mm |
| Press-In Force | On nominal hole diameter | 204 N/pin |
| Retention Force | On nominal hole diameter | 13.5 N/pin |
