The DL Series ZIF connectors by ITT Cannon, VEAM, and BIW represent a historical achievement in technology leadership, defining and championing innovation. These connectors are designed for reliability and cost-effectiveness, offering a broad range of interconnect solutions utilized across diverse markets including Military/Aerospace, Civil Aircraft, Industrial Instrumentation, Medical, Oil & Gas, Energy, Transportation, Telecom/Handset, Computer, Consumer, and Automotive. ITT's interconnect history is marked by contributions to technological breakthroughs and social movements, supporting applications from space missions and broadcasting to communication systems, computing, transportation, energy production, and agricultural equipment.
When specifying a Cannon, VEAM, or BIW connector, customers can rely on products designed, developed, and manufactured to the highest quality and reliability standards, driven by ITT's corporate culture of Six Sigma principles. This ensures the development of industry-leading products within market-driven lead times.
| Series | Type | Body Material | Available Layouts | Contact Types | EMI/RFI Shielding | Current Rating | Mating Cycles | Operating Temperature |
|---|---|---|---|---|---|---|---|---|
| DL | Plug & Receptacle | Plastic | 60, 96, 156, 260 signal | Crimp, Square Post | - | 5 A max. | 10,000 min. | -55C to 105C |
| DLM | Plug & Receptacle | Metal | 60, 96, 156, 260 and 360 signal | Crimp, Square Post, PC/RC | Yes | 5 A max. / 4 A max. | 10,000 min. | -55C to 105C |
| DLP | Plug & Receptacle | Metal | 136, 204, 272 signal (DLP-272); 408 signal (DLP-408) | Modular Landed Contact System (Crimp, Square Post, PC/RC) | Yes | 0.5 A max. (DLP-272); 0.3 A max (DLP-408) | 10,000 max | -55C to 85C |
| QLC | Plug & Receptacle | Metal | 260 signal | Pressfit, Solder to PCB through hole | Yes | 0.5 A max. | 20,000 max | -55C to 85C |
| Series | Contact Material | Contact Resistance | Factory Terminated | Accessories |
|---|---|---|---|---|
| DL | 20 or 50 inches gold plated copper alloy | 15 milliohms max. | Solder to PCB through hole | Actuating handles, Protective Cover (Rubber/Plastic), Metal Shell for EMI/RFI shielding, Plastic Junction Shell, Cable Clamps, Metal Backshell |
| DLM | 20 or 50 inches gold plated copper alloy | 15 milliohms max. | Solder to PCB through hole | Actuating handles, Protective Cover (Plastic), Metal Shell for EMI/RFI shielding, Plastic Junction Shell, Cable Clamps, Metal Backshell |
| DLP | Gold plated copper Alloy | 30 milliohms max. (Initial) | Press-fit (DLP-408); Solder to PCB through hole (DLP-272) | Actuating handles, Protective Cover (Plastic), Metal Shell for EMI/RFI shielding, Plastic Junction Shell, Cable Clamps, Metal Backshell |
| QLC | 40 inch gold plated copper alloy | 20 milliohms max. (5) | Press-fit | Actuating handles |
