The ExaMAX High-Speed Backplane System and Cable Assemblies offer advanced connectivity for demanding applications. Featuring a staggered differential pair design, reliable two-point contact with a 2.4 mm wipe, and shielded wafer design to reduce crosstalk, this system is engineered for superior signal integrity. It supports PCIe 6.0/CXL 3.1 capabilities and can reduce costs through lower layer counts. The system is highly customizable with modular flexibility and is available in various configurations to meet diverse design needs.
| Series | Insulator Material | Contact Material | Plating | Operating Temp Range | Current Rating | Voltage Rating | Lead-Free Solderable | Pitch | Cable Assembly AWG | System Pair Designs |
|---|---|---|---|---|---|---|---|---|---|---|
| EBTM/EBTF/EBDM | Liquid Crystal Polymer | Copper Alloy | Sn or Au over 50 " (1.27 m) Ni | -55 C to +105 C | 4 A per pin | 150 VAC | Yes | (2.00 mm) .0787" | - | - |
| EPTT/EPTS | High Temperature Thermoplastic | Copper Alloy | Sn or Au over 50 " (1.27 m) Ni | -55 C to +105 C | 14.1 A per pin | 150 VAC | Yes | (2.00 mm) .0787" | - | - |
| EBCM/EBCF | Liquid Crystal Polymer | Copper Alloy | Au over 50 " (1.27 m) Ni | -40 C to +105 C | 3.6 A per pin | 125 VAC | N/A | (2.00 mm) .0787" | 30 & 34 AWG (Eye Speed Ultra Low Skew Twinax Cable) | 24 - 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns) |
