The ExaMAX High-Speed Backplane System is designed for demanding applications requiring reliable, high-speed data transmission. It offers a staggered differential pair design for reduced crosstalk and two reliable points of contact with a 2.4 mm wipe. The system is highly customizable with modular flexibility, enabling lower layer counts and cost reduction. It is PCIe 6.0/CXL 3.1 capable and exceeds OIF CEI-28G-LR specification for 28 Gbps standards. Available in 24-72 pair designs with various column configurations, the system features press-fit tails for reliable electrical connections and shielded wafer designs. ExaMAX High-Speed Backplane Cable Assemblies utilize Eye Speed Ultra Low Skew Twinax Cable for improved signal integrity, flexibility, and routability, with an Eye Speed Thinax ultra performance twinax cable version in development.
| Series | Insulator Material | Contact Material | Plating | Operating Temp Range | Current Rating | Voltage Rating | Lead-Free Solderable | Description |
| EBTM/EBTF/EBDM | Liquid Crystal Polymer | Copper Alloy | Sn or Au over 50 " (1.27 m) Ni | -55 C to +105 C | 4 A per pin | 150 VAC | Yes | Traditional, Coplanar and Direct Mate Orthogonal |
| EPTT/EPTS | High Temperature Thermoplastic | Copper Alloy | Sn or Au over 50 " (1.27 m) Ni | -55 C to +105 C | 14.1 A per pin | 150 VAC | Yes | Right-Angle Socket & Direct-Mate Orthogonal |
| EBCM/EBCF | Liquid Crystal Polymer | Copper Alloy | Au over 50 " (1.27 m) Ni | -40 C to +105 C | 3.6 A per pin | 125 VAC | N/A | Cable Mates |
