The TE Connectivity Inverted Card Edge Through Board Connector (PN 2213188-x) is designed for high-performance connectivity in electronic equipment. This connector facilitates through-board mating, ensuring reliable electrical connection and mechanical stability in demanding environments.
| Test Category | Test Description | Requirement | Procedure |
|---|---|---|---|
| Electrical | LLCR | 10m max initial, 20m max final | EIA-364-23 |
| Electrical | Insulation Resistance | 1000M min initial, 500M min final | EIA-364-21 |
| Electrical | Withstanding Voltage | No breakdown or flashover (1800V AC) | EIA-364-20 |
| Electrical | Temperature Rise | 30C max temperature rise | EIA-364-70 |
| Mechanical | Solderability | 95% min solder coverage | J-STD-002D |
| Mechanical | Random Vibration | No discontinuities > 1s | EIA-364-28 |
| Mechanical | Mechanical Shock | No discontinuities > 1s | EIA-364-27 |
| Mechanical | Durability | 5 cycles | EIA-364-9 |
| Mechanical | Mating Force | 45N max | EIA-364-13 |
| Mechanical | Unmating Force | 4N min | EIA-364-13 |
| Environmental | Thermal Shock | 5 cycles (-40 to 130C) | EIA-364-32 |
| Environmental | Humidity/Temp Cycling | 10 cycles (25 to 65C) | EIA-364-31 |
| Environmental | Temperature Life | 130C for 500 hours | EIA-364-17 |
