Product Overview
The 3M Chip Carrier Sockets, 8400 Series, are designed for through-hole mounting and offer a low-profile solution for accepting chip carriers conforming to JEDEC outlines MO-047 (square) and MO-052 (rectangular). These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow. Molded slots facilitate easy device extraction. They are suitable for wave soldering processes but not for reflow soldering. These sockets are RoHS Compliant.
Product Attributes
Technical Specifications
| Specification | Details |
|---|---|
| Insulation Material | Glass Filled Polyester (PBT) |
| Contact Material | Copper Alloy |
| Plating - Underplating | 50 " [ 1.27 m ] Nickel |
| Plating - Overall Wiping Area | 160 ", [ 4.06 m ] Matte Tin |
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Wave Solder Only |
Ordering Information
| Contact Quantity | Part Number | A [inch] | B [inch] | C [inch] | D [inch] |
|---|---|---|---|---|---|
| 20 | 8420-11B1-RK-TP | 15.50 [0.611] | 15.50 [0.611] | 5.08 [0.200] | 5.08 [0.200] |
| 28 | 8428-11B1-RK-TP | 18.05 [0.711] | 18.05 [0.711] | 7.62 [0.300] | 7.62 [0.300] |
| 32 | 8432-11B1-RK-TP | 18.05 [0.711] | 20.60 [0.812] | 7.62 [0.300] | 10.16 [0.400] |
| 44 | 8444-11B1-RK-TP | 23.50 [0.926] | 23.50 [0.926] | 12.70 [0.500] | 12.70 [0.500] |
| 52 | 8452-11B1-RK-TP | 25.88 [1.020] | 25.88 [1.020] | 15.24 [0.600] | 15.24 [0.600] |
| 68 | 8468-11B1-RK-TP | 31.05 [1.223] | 31.05 [1.223] | 20.32 [0.801] | 20.32 [0.801] |
| 84 | 8484-11B1-RK-TP | 36.05 [1.420] | 36.05 [1.420] | 25.40 [1.001] | 25.40 [1.001] |
Important Notice Regarding Tin Whiskers:
3M PLCC products have tin-plated contact wiping surfaces, which is necessary for mated reliability with standard tin-plated PLCC contacts. Tin whiskers are an inherent characteristic of tin. Mechanically stressing the tin can be a known driver of whisker growth. It is possible that PLCC and PLCC sockets may exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations, including whisker-mitigating tin plating chemistry, to reduce the likelihood of tin whisker growth. Users should consider the suitability of a PLCC socket for their specific application, taking into account the product application's lifespan, environment, mechanical stresses, humidity, and thermal cycling, as these factors can stimulate tin whisker growth.
