These surfacemount chip carrier sockets are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular devices. They feature a high-temperature insulator compatible with IR reflow and wave soldering, and are compatible with automated loading equipment. The open-top design allows for unrestricted airflow, and molded slots facilitate easy device extraction. Optional PCB locating posts are available. These sockets are RoHS Compliant.
3M
8400 Series
Glass Filled Polyphenylene Sulfide (PPS)
UL 94V-0
Black
Copper Alloy
50 " [ 1.27 m ] Nickel
160 " [ 4.06 m ] Matte Tin
15 m
>103 M minimum
< 1 pF at 1 MHz
-40C to +105C
Maximum 260C, single pass, (profile per J-STD-020C)
1 (per J-STD-020C)
RoHS Compliant
Tube Pack (TP), Tape and Reel (TR)
With Location Post (A), Without Location Post (B)
| Contact Quantity | Dimension A (mm/in) | Dimension A (mm/in) | Dimension C (mm/in) | Dimension D (mm/in) | Dimension E (mm/in) | Dimension F (mm/in) | Dimension G (mm/in) | Dimension H (mm/in) |
|---|---|---|---|---|---|---|---|---|
| 20 | 15.65 [0.616] | 15.65 [0.616] | 5.08 [0.200] | 5.08 [0.200] | 10.03 [0.395] | 10.03 [0.395] | 12.70 [0.500] | 6.35 [0.250] |
| 28 | 18.18 [0.716] | 18.18 [0.716] | 7.62 [0.300] | 7.62 [0.300] | 12.57 [0.495] | 12.57 [0.495] | 15.24 [0.600] | 7.62 [0.300] |
| 32 | 18.18 [0.716] | 20.75 [0.817] | 7.62 [0.300] | 10.16 [0.400] | 12.57 [0.495] | 15.11 [0.595] | 17.78 [0.700] | 7.62 [0.300] |
| 44 | 23.28 [0.917] | 23.28 [0.917] | 12.70 [0.500] | 12.70 [0.500] | 17.65 [0.695] | 17.65 [0.695] | 20.32 [0.800] | 10.16 [0.400] |
| 52 | 25.84 [1.017] | 25.84 [1.017] | 15.24 [0.600] | 15.24 [0.600] | 20.19 [0.795] | 20.19 [0.795] | 22.86 [0.900] | 11.43 [0.450] |
| 68 | 30.95 [1.219] | 30.95 [1.219] | 20.32 [0.800] | 20.32 [0.800] | 25.27 [0.995] | 25.27 [0.995] | 27.94 [1.100] | 13.97 [0.550] |
| 84 | 36.00 [1.417] | 36.00 [1.417] | 25.40 [1.000] | 25.40 [1.000] | 30.35 [1.195] | 30.35 [1.195] | 33.02 [1.300] | 16.51 [0.650] |
