The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular. These sockets feature high-temperature insulators compatible with IR reflow and wave soldering, and are compatible with automated loading equipment. The open-top design allows for unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available. These sockets are RoHS Compliant.
| Contact Quantity | Dimension A (mm) | Dimension A (inch) | Dimension B (mm) | Dimension B (inch) | Dimension C (mm) | Dimension C (inch) | Dimension D (mm) | Dimension D (inch) | Dimension E (mm) | Dimension E (inch) | Dimension F (mm) | Dimension F (inch) | Dimension G (mm) | Dimension G (inch) | Dimension H (mm) | Dimension H (inch) | Alignment Feature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 20 | 15.65 | 0.616 | 15.65 | 0.616 | 5.08 | 0.200 | 5.08 | 0.200 | 10.03 | 0.395 | 10.03 | 0.395 | 12.70 | 0.500 | 6.35 | 0.250 | A, B |
| 28 | 18.18 | 0.716 | 18.18 | 0.716 | 7.62 | 0.300 | 7.62 | 0.300 | 12.57 | 0.495 | 12.57 | 0.495 | 15.24 | 0.600 | 7.62 | 0.300 | A, B |
| 32 | 18.18 | 0.716 | 20.75 | 0.817 | 7.62 | 0.300 | 10.16 | 0.400 | 12.57 | 0.495 | 15.11 | 0.595 | 17.78 | 0.700 | 7.62 | 0.300 | A, B |
| 44 | 23.28 | 0.917 | 23.28 | 0.917 | 12.70 | 0.500 | 12.70 | 0.500 | 17.65 | 0.695 | 17.65 | 0.695 | 20.32 | 0.800 | 10.16 | 0.400 | A, B |
| 52 | 25.84 | 1.017 | 25.84 | 1.017 | 15.24 | 0.600 | 15.24 | 0.600 | 20.19 | 0.795 | 20.19 | 0.795 | 22.86 | 0.900 | 11.43 | 0.450 | A, B |
| 68 | 30.95 | 1.219 | 30.95 | 1.219 | 20.32 | 0.800 | 20.32 | 0.800 | 25.27 | 0.995 | 25.27 | 0.995 | 27.94 | 1.100 | 13.97 | 0.550 | A, B |
| 84 | 36.00 | 1.417 | 36.00 | 1.417 | 25.40 | 1.000 | 25.40 | 1.000 | 30.35 | 1.195 | 30.35 | 1.195 | 33.02 | 1.300 | 16.51 | 0.650 | A, B |
| Electrical Specification | Value |
|---|---|
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
Please be aware that the 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Since tin whiskers are an inherent characteristic of tin and mechanically stressing the tin is a known driver of whisker growth, it is possible the PLCC and PLCC socket may exhibit tin whisker growth after mating. 3M follows the iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Please consider whether a PLCC socket is suitable for your particular needs after considering your product applications life span and environment including mechanical stresses, humidity, and thermal cycling all of which have been shown to stimulate tin whisker growth.
