The DF19 Series is a 1.0mm pitch connector designed for low-profile wire-to-board, FPC-to-board, and micro-coaxial cable-to-board applications. It has become the de facto standard for LCD panel connections (12in. or less) due to its high performance for LVD high-speed differential signals. The series features a low-profile design, common header compatibility across different socket types, uniform external dimensions, and a variety of mounting styles. It also includes ground connection with the outer shell and is Glow Wire Compatible (IEC60695-2-11 Standard).
| Item | Specification | Conditions |
|---|---|---|
| Rated Current | 1A/pin (28 AWG), 0.9A/pin (30 AWG), 0.8A/pin (32 AWG), 0.5A/pin (36 AWG, FPC), 0.5A/pin (40 AWG, Micro-coaxial Cable), 0.3A/pin (Micro-coaxial Cable) | |
| Operating Temperature | -35 to +85 | (Note 1: Includes temperature rise due to current flow) |
| Operating Humidity Range | 40 to 80% | (Note 2: Please use without condensation) |
| Rated Voltage | 100V AC/DC | |
| Storage Temperature Range | -10 to +60 | (Note 3: Applicable to unused items in packaged state) |
| Storage Humidity Range | 40 to 70% | (Note 3: Applicable to unused items in packaged state) |
| Insulation Resistance | 500M Min. | 100V DC |
| Withstanding Voltage | No flashover or insulation breakdown. | 300V AC for 1 min. |
| Contact Resistance | 30m Max. (50m Max. for FPC) | 1mA |
| Vibration | No electrical discontinuity of 1 s or more. | Frequency: 10 to 55 Hz, single amplitude of 0.75mm, in 3 directions for 10 cycles |
| Humidity (Steady State) | Contact Resistance: 30m Max. (50m Max. for FPC) Insulation Resistance: 500M Min. | 96 hours at temperature of 40 2 and humidity of 90 to 95% |
| Temperature Cycle | Contact Resistance: 30m Max. (50m Max. for FPC) Insulation Resistance: 500M Min. | Temperature: -55 +5 to +35 +85 +5 to +35 Time (Minutes): 30 10 30 10 for 5 cycles |
| Mating Durability | Contact Resistance: 30m Max. (50m Max. for FPC) | 30 cycles |
| Soldering Heat Resistance | No deformation of the insulator parts affecting performance. | Re-flow soldering: At the recommended temperature profile Manual soldering: Soldering iron temperature 350, 5 seconds |
Connector: DF19 # - # P - 1 H52 / DF19 # - # S - 1 F - GND
Crimp Contact: DF19A - 2830 SCF A (##)
Mobile phones, LCD connections, DVC, DSC, PDA, camera modules, and other small equipment, Notebook PCs.
