This product appears to be a connector or socket, likely for memory modules (e.g., DDR3 SODIMM). It features a mechanical key for proper orientation and a latch mechanism for secure mating. The product is designed for PCB mounting and is constructed from high-temperature thermoplastic with copper alloy contacts and stainless steel lock levers.
| Part Number | Pitch | Height | Type | Contact Finish (Area) | Contact Finish (Soldering Area) | Peg Finish | Coplanarity (Max) | PCB Thickness |
|---|---|---|---|---|---|---|---|---|
| DDR3 SODIMM Socket | 0.6 mm | 9.2 mm | Reverse Type | Gold Flash (0.000254 mm min) over Nickel | Gold Flash Plating | Tin Plating | 0.1 mm (Before Soldering) | 3.8 mm |
| DDR3 SODIMM Socket | 0.6 mm | 9.2 mm | Reverse Type | 0.00076 mm Gold over Nickel | Gold Flash Plating | Tin Plating | 0.1 mm (Before Soldering) | 3.8 mm |
| DDR3 SODIMM Socket | 0.6 mm | 9.2 mm | Reverse Type | 0.007 mm Gold over Nickel | Gold Flash Plating | Tin Plating | 0.1 mm (Before Soldering) | 3.8 mm |
| Pad Finish | Chamfer (Max) | Component Area (Front Side) | Component Area (Back Side) | Mechanical Key Center Line |
|---|---|---|---|---|
| Gold Plating 0.00076 min. Over Ni Plating 0.002min | 0.25 x 45 | 21.5 mm | 25.1 mm | 35 mm |
