FCI's Vertical DDR4 DIMM sockets offer 288 contacts on a 0.85mm pitch, designed to accommodate DDR4 memory modules conforming to JEDEC MO-309. These sockets are engineered for convenient memory expansion in servers, workstations, desktop PCs, and embedded applications within communications and industrial equipment. Featuring low-resistance contacts, they support Registered DIMMs (RDIMM) to reduce power consumption in datacenter hardware like servers, storage, and networking equipment. The low 2.4mm module seating plane and slim ejector designs optimize airflow. Available termination options include Surface-Mount (SMT), Plated-Through-Hole (PTH) solder, and Press-Fit (PF).
| Specification | Details |
|---|---|
| Product Type | Vertical DDR4 DIMM Sockets |
| Contact Pitch | 0.85mm |
| Number of Contacts | 288 |
| Module Standard | JEDEC MO-309 |
| Module Seating Plane | 2.4mm |
| Insertion Force | < 24 pounds force |
| Solder Tail Thickness Support | 1.6mm or 2.4mm motherboards |
| Press-fit Termination Support | 1.6mm min. host-PCBs |
| High-Speed Signaling | Up to 3.2Gb/s for DDR4 |
| Contact Resistance | 10m initial, 10m increase after environmental test |
| Current Rating | 0.75A/contact (De-rated) with 30 C temperature rise above ambient |
| Durability | 25 cycles |
| Product Specification | GS-12-1092 |
| Packaging Specification | GS-14-2267 |
| JEDEC Module Outline | MO-309 |
| JEDEC Socket Outlines | PTH solder: SO-016, Surface-mount: SO-017, Press-fit: SO-019 |
| Part Reference (SMT) | 10124677 |
| Part Reference (PTH Solder) | 10124632 |
| Part Reference (Press-fit) | 10124806 |
| BWBDDR4MMS0613EA4 | Part Number |
