Function: DDR SODIMM, SO DIMM Sockets for Double Data Rate (DDR) memory modules.
Usage Conditions: Operating Temperature Range -55 to 85 C [-67 to 185 F].
Application: Power, Circuit applications.
TE
DDR SODIMM, SO DIMM Sockets
Double Data Rate (DDR)
Right Angle
9.2 mm [.362 in]
6.2 mm [.244 in]
0.6 mm [.024 in]
200
2
2
1
High Temperature Thermoplastic
Black
Copper Alloy
Gold Flash
Gold Flash
Stainless Steel
Tin
Locking
Both Ends
Ultra High
25V
SA
20
Semi-Hard Tray Assembly
Surface Mount
Board Mount
Solder Peg
Standard Keying
Cam-In
UL 94v-0
Low Halogen - Br, CI, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free
Reflow solder capable to 245C
Compliant
Compliant
MIIT Order No 32, 2016 No Restricted Materials Above Threshold
Current ECHA Candidate List: JUNE 2024 (241), Candidate List Declared Against: JUNE 2024 (241), Does not contain REACH SVHC
| Part Number | DRAM Type | Stack Height | Module Orientation | Number of Positions | Centerline (Pitch) | SGRAM Voltage | Packaging Quantity | UL Flammability Rating | Termination Method to PCB | Connector Mounting Type | Housing Material | Contact Base Material | Plating Material (Termination Area) | Plating Material (Mating Area) | Latch Material | Halogen Content | Solder Process Capability |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1612618-1 | Double Data Rate (DDR) | 9.2 mm [.362 in] | Right Angle | 200 | 0.6 mm [.024 in] | 25V | 20 | UL 94v-0 | Surface Mount | Board Mount | High Temperature Thermoplastic | Copper Alloy | Gold Flash | Gold Flash | Stainless Steel | Low Halogen | Reflow solder capable to 245C |
