This product is a DDR3 R-DIMM Connector designed for very low profile modules. It is compliant with JEDEC SO-007 and accepts JEDEC module MO-269, variations AA through FC. The connector is built with high-performance, glass-filled, UL94V-0 rated resins for housing and ejectors, and copper alloy for terminals and metal clips. It meets European Union directives and other country regulations as described in GS-22-008. The housing can withstand exposure to 260C peak temperature for 10 seconds in a wave solder application, and the clear latch can withstand a maximum exposure temperature of 174C.
| Specification | Value | Notes |
|---|---|---|
| Product Type | DDR3 R-DIMM Connector | Very Low Profile Module |
| Catalog Number | D 10081531 | |
| PCB Seating Depth | 3.12 0.10 mm | |
| Slot Length | 128.76 0.10 mm | |
| Slot Width | 133.75 0.10 mm | |
| Dimension "A" | 12.00 mm | For Part No. 10081531-1**** |
| Dimension "A" | 11.00 mm | For Part No. 10081531-2**** |
| Dimension "A" | 13.00 mm | For Part No. 10081531-3**** |
| Dimension "B" | 9.50 mm | |
| Voltage | 1.5V | For Style 1 (Center Key "XB") |
| Voltage | X.X V | For Style 2 (Left Key "XA") |
| Voltage | X.X V | For Style 3 (Right Key "XC") |
| Plastic Peg Length | 4.30 mm | Code 1 |
| Contact Solderail Underplate | 15" (0.38m) Min. Gold / 100" (2.54m) Min. Tin/Lead / 50" (1.27m) Min. Nickel Overall | Code 2 |
| Contact Solderail Underplate | 30" (0.76m) Min. Gold | Code 3 |
| Contact Solderail Underplate | 3" (0.07m) Min. Gold | Code 4 |
| Contact Solderail Underplate | 15" (0.38m) Min. Gold / 100" (2.54m) Min. 100% Tin / 50" (1.27m) Min. Nickel Overall | Code 7LF |
| Contact Solderail Underplate | 30" (0.76m) Min. Gold | Code 8LF |
| Contact Solderail Underplate | 3" (0.07m) Min. Gold | Code 9LF |
| Mechanical Keying | 1: 1.5 Volt. w/ Center Key "XB" | |
| Mechanical Keying | 2: X.X Volt. w/ Left Key "XA" | |
| Mechanical Keying | 3: X.X Volt. w/ Right Key "XC" | |
| Solder Application Temperature Resistance | 260C Peak Temperature for 10 Seconds | Housing |
| Latch Temperature Resistance | Max 174C Exposure Temperature | Clear Latch |
| Card Thickness | Applies across tabs and includes plating and/or metalization. |
