This DDR3 R-DIMM connector is designed for very low profile modules, compliant with JEDEC SO-007 and accepting JEDEC module MO-269, variations AA through FC. It features a robust construction with high-performance resins, glass-filled UL94V-0 rated housing and ejectors, and copper alloy terminals and metal clips. The connector is engineered for wave soldering applications, withstanding peak temperatures of 260C for 10 seconds. It offers various mechanical keying options for different voltage requirements and center key configurations, along with multiple color options for housing and ejector combinations.
| Specification | Value | Notes |
|---|---|---|
| Catalog No. | D 10081531 | |
| Product Type | DDR3 R-DIMM CONNECTOR | Very Low Profile Module |
| Module Compatibility | JEDEC MO-269 (Variations AA-FC) | Compliant to JEDEC SO-007 |
| PCB Seating Depth | 3.12 0.10 mm | |
| Slot Length | 128.76 0.10 mm | |
| Slot Width | 133.75 0.10 mm | |
| Dim "A" | 12.00 mm | For Part No. 10081531-1**** |
| Dim "A" | 11.00 mm | For Part No. 10081531-2**** |
| Dim "A" | 13.00 mm | For Part No. 10081531-3**** |
| Dim "B" | 2.67 mm | For Code 1 |
| Dim "B" | 3.18 mm | For Code 2 |
| Voltage Support | 1.5V | With Center Key "XB" (Code 1) |
| Voltage Support | X.X V | With Left Key "XA" (Code 2) |
| Voltage Support | X.X V | With Right Key "XC" (Code 3) |
| Plastic Peg Length | 4.30 mm | Code 1 |
| Contact Solderetail Underplate | 15" (0.38m) MIN. GOLD / 100" (2.54m) MIN. TIN/LEAD / 50" (1.27m) MIN. NICKEL OVERALL | Code 2 |
| Contact Solderetail Underplate | 30" (0.76m) MIN. GOLD | Code 3 |
| Contact Solderetail Underplate | 3" (0.07m) MIN. GOLD | Code 4 |
| Contact Solderetail Underplate | 15" (0.38m) MIN. GOLD / 100" (2.54m) MIN. 100% TIN / 50" (1.27m) MIN. NICKEL OVERALL | Code 7LF |
| Contact Solderetail Underplate | 30" (0.76m) MIN. GOLD | Code 8LF |
| Contact Solderetail Underplate | 3" (0.07m) MIN. GOLD | Code 9LF |
| Housing Color Options | Black, Blue, Ivory | |
| Ejector Color Options | Ivory, Clear, Black, Blue | |
| Card Thickness | 1.45+0.05/-0.07 mm | Includes plating and/or metalization |
| Max PCB Footprint | 142.00 mm |
