Transistor Socket manufacturer from China of page 12

3M 8444-21B1-RK-TP

Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and ...

TE Connectivity 1-2324271-3

Product Overview The P4/5 Hard Tray is designed to securely hold and organize components, likely for electronic or similar applications. It is used to segment and protect parts during handling, storage, and transportation. Part Type SOCKET P4/5 HARD TRAY Packaging Per Outer Box, Per Inner Box, Per ...

3M 8444-21A1-RK-TP

Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular applications. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are ...

3M 8420-21B1-RK-TP

Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular configurations. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are ...

3M 4840-6004-CP

Product Overview The 3M DIP Socket Stamped and Formed, Dual-Wipe 4800 Series offers reliable termination with a dual leaf, high compression contact. Designed for automatic insertion compatibility with most insertion equipment, these sockets are side and end stackable. They are RoHS Compliant, with ...

3M 4816-3004-CP

Product Overview The 3M DIP Socket Stamped and Formed, Dual-Wipe 4800 Series offers reliable termination with its dual leaf, high compression contact. Designed for automatic insertion compatibility with most insertion equipment, these sockets are side and end stackable. They are RoHS Compliant. ...

XKB Connection X5621FVS-2x09-C1524D1988

Technical DataMaterial (Pin)Brass, machined CuZn38Pb2Material (Clip)Beryllium copper, heat treatedMaterial (Insulator)PBT UL94V-0Color (Insulator)BlackPlating (Tin)2um/80u" NI, 5um/200u" SnPlating (Gold)2um"/80u" Ni, GFCurrent Rating3 AmpsContact Resistancemax 10m Dielectric Strengthmin 1000V ...

3M 4808-3000-CP

TE Connectivity 840-AG11D-ESL-LF

Product OverviewThe 840-AG11D-ESL-LF is a standard DIP socket featuring a stamped & formed, open design with gold contact plating. It is designed for through-hole solder termination to printed circuit boards and offers a standard profile with a 2.54 mm [.1 in] centerline pitch. This socket is ...

10 11 12 13 14 Next