Press fit header 110 contacts 2 mm pitch with grounding rows and EMI immunity 3M CP2 HDE200 E1 KR
Manufacturer:
3M
Description:
Hard Metric, Standard RoHS
Category:
Backplane Connector Accessories/Hard Metric, Standard
Specifications
Mfr. Part #:
CP2-HDE200-E1-KR
Model Number:
CP2-HDE200-E1-KR
Introduction
Product Overview
The 3M CP2 Press-Fit Header, 2 mm Type A, 110 Signal Contacts, CP2 Series, offers high signal density at a low cost due to its 2 mm grid spacing. It features an "Eye of the Needle" compliant pin press-fit design that reduces manufacturing time and cost. With three contact mating levels, it supports Early Mate Late Break or "Hot Swap" applications. Additional grounding rows are available for improved ground bounce and EMI immunity. This header is end-to-end stackable with 5-row 3M HSHM, HM, and CP2 Headers and mates with 5-row 3M HSHM, UHM, and CP2 Sockets. Feed-through termination is available for midplane applications.
Product Attributes
- Brand: 3M
- Product Line: CP2 Series
- Contact Type: Press-Fit Header
- Grid Spacing: 2 mm
- Signal Contacts: 110
- Material (Insulation): Glass Filled Polyester (PBT)
- Flammability: UL94V-0
- Material (Contact): Copper Alloy
- Compliance: RIA E1 & C1 apply
Technical Specifications
| Specification | Details |
|---|---|
| Basic System Unit | 25 mm |
| Module | 50 mm |
| Mating Force | ≤ 0.75N/PIN |
| Withdrawal Force | ≥ 0.15N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70°C (with all contacts powered) |
| Contact Resistance | ≤ 20 mΩ |
| Insulation Resistance | ≥ 10,000 MΩ |
| Test Voltage | 750 VACRMS |
| Temperature Ratings | -55°C to +125°C |
| Recommended PCB Plated Through Hole Diameter | Ø 0.6±0.05 mm |
| Drill Hole Diameter | Ø 0.7±0.02 mm |
| PCB Thickness (3.7 mm tails) | 2.4 - 5.6 mm |
| PCB Thickness (2.3 mm tails) | 1.4 - 5.6 mm |
| Press-In Force | ≤ 204N/pin (on nominal hole diameter) |
| Retention Force | ≥ 13.5N/pin (on nominal hole diameter) |
| Primary Tail Length Options | 3.7 mm, 2.3 mm, 15.8 mm |
| Plating Options (FJ) | 10~20 µ" Gold Contact Area, 100~200 µ" Matte Tin, 50~80 µ" Nickel Underplate |
| Plating Options (KR) | 30~40 µ" Gold Contact Area, 100~200 µ" Matte Tin, 50~80 µ" Nickel Underplate |
| Plating Options (KV) | 30-40 u" Mate End Gold Contact area, Gold Flash Tail Contact area, 50-80 u" Nickel Underplate |
2506301155_3M-CP2-HDE200-E1-KR_C3648589.pdf
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