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high temperature LCP resin housing connector 3M SPD08-040-L-RB-TR for high speed signal transmission

Manufacturer:
3M
Description:
Edgeboard Connectors RoHS
Category:
Edgeboard Connectors/Edgeboard Connectors
Specifications
Mfr. Part #:
SPD08-040-L-RB-TR
Model Number:
SPD08-040-L-RB-TR
Introduction

3M High-Speed Card-Edge Connector SPD08

Product Overview

The 3M High-Speed Card-Edge Connector SPD08 is a versatile connector designed for high-density board-to-board (B2B) and wire-to-board (W2B) applications. It offers high-speed signal transmission performance up to 15 Gbps for B2B and 20 Gbps for W2B configurations. Featuring a flexible stack height range from 16 mm to 40 mm and robust tolerance for misalignment, this connector ensures reliable connections in demanding environments. Its high-temperature LCP resin housing withstands 260 C lead-free SMT processes. The SPD08 is ideal for internal protocols like PCI Express and is commonly used in base stations, servers, hubs, switches, and routers.

Product Attributes

  • Brand: 3M
  • Division: Electronic Solutions Division
  • Material (Housing): High temp LCP resin
  • Plating Option: 0.76um GOLD (Standard)
  • Packaging Option: TRAY, TAPE & REEL (Standard)

Technical Specifications

Specification Details
Pitch 0.80 mm
Signal Transmission Performance (B2B) Up to 15 Gbps
Signal Transmission Performance (W2B) Up to 20 Gbps
Stack Height 16 mm to 40 mm
Misalignment Tolerance (X, Y) 0.8 mm
Misalignment Tolerance (Z) 1.0 mm (at 30 mm stack height)
Current Carrying Capacity (Single Pin) Up to 3.0 A
Current Rating (Fully Loaded) 0.5 A
SMT Temperature Resistance Withstand 260 C lead-free SMT
Mating Card Thickness 1.57 0.16 mm
Insertion Force (mated with 1.57 mm card) Average 0.40 N/Pin
Latching Option With Latch (L), Without Latch (Blank)
Number of Positions 020, 040, 060, 064, 080, 100, 120, 140, 160, 180, 200 (Note: All positions are not tooled. Refer to sales drawing for currently tooled positions.)
Insert Loss (SDD21) 7.5 GHz @ -3dB

2412091214_3M-SPD08-040-L-RB-TR_C6681163.pdf

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