high temperature LCP resin housing connector 3M SPD08-040-L-RB-TR for high speed signal transmission
3M High-Speed Card-Edge Connector SPD08
Product Overview
The 3M High-Speed Card-Edge Connector SPD08 is a versatile connector designed for high-density board-to-board (B2B) and wire-to-board (W2B) applications. It offers high-speed signal transmission performance up to 15 Gbps for B2B and 20 Gbps for W2B configurations. Featuring a flexible stack height range from 16 mm to 40 mm and robust tolerance for misalignment, this connector ensures reliable connections in demanding environments. Its high-temperature LCP resin housing withstands 260 C lead-free SMT processes. The SPD08 is ideal for internal protocols like PCI Express and is commonly used in base stations, servers, hubs, switches, and routers.
Product Attributes
- Brand: 3M
- Division: Electronic Solutions Division
- Material (Housing): High temp LCP resin
- Plating Option: 0.76um GOLD (Standard)
- Packaging Option: TRAY, TAPE & REEL (Standard)
Technical Specifications
| Specification | Details |
|---|---|
| Pitch | 0.80 mm |
| Signal Transmission Performance (B2B) | Up to 15 Gbps |
| Signal Transmission Performance (W2B) | Up to 20 Gbps |
| Stack Height | 16 mm to 40 mm |
| Misalignment Tolerance (X, Y) | 0.8 mm |
| Misalignment Tolerance (Z) | 1.0 mm (at 30 mm stack height) |
| Current Carrying Capacity (Single Pin) | Up to 3.0 A |
| Current Rating (Fully Loaded) | 0.5 A |
| SMT Temperature Resistance | Withstand 260 C lead-free SMT |
| Mating Card Thickness | 1.57 0.16 mm |
| Insertion Force (mated with 1.57 mm card) | Average 0.40 N/Pin |
| Latching Option | With Latch (L), Without Latch (Blank) |
| Number of Positions | 020, 040, 060, 064, 080, 100, 120, 140, 160, 180, 200 (Note: All positions are not tooled. Refer to sales drawing for currently tooled positions.) |
| Insert Loss (SDD21) | 7.5 GHz @ -3dB |
2412091214_3M-SPD08-040-L-RB-TR_C6681163.pdf