Connector with high signal density 3M CP2 SB110 G1 FJ press fit socket right angle design 2 mm pitch
Manufacturer:
3M
Description:
Hard Metric, Standard RoHS
Category:
Backplane Connector Accessories/Hard Metric, Standard
Specifications
Mfr. Part #:
CP2-SB110-G1-FJ
Model Number:
CP2-SB110-G1-FJ
Introduction
Product Overview
The 3M CP2 Press-Fit Socket, 2 mm Type B, is a right-angle connector designed for high signal density at a low cost, featuring a 2 mm grid spacing. It adheres to IEC 61076-4-101 and IEC 60352-5 standards. The 'Eye of the Needle' compliant pin press-fit design simplifies manufacturing and reduces costs. An optional grounding row enhances ground bounce and EMI immunity. This socket is end-to-end stackable with various 5-row 3M sockets and mates with 5-row 3M HM and CP2 Headers. It is suitable for applications requiring high signal density and reliable interconnects, but is not intended for stand-alone use.
Product Attributes
- Brand: 3M
- Series: CP2
- Type: Press-Fit Socket, Right Angle
- Grid Spacing: 2 mm
- Standards: IEC 61076-4-101, IEC 60352-5
- Insulation Material: High Temperature Thermoplastic (LCP)
- Contact Material: Copper Alloy
- Flammability: UL94V-0
- Plating Options: FJ (Gold Contact Area, Matte Tin, Nickel Underplate), KR (Gold Contact Area, Matte Tin, Nickel Underplate)
- Regulatory Compliance: RIA E1 & C1 apply (Refer to www.3Mconnectors.com for RoHS compliance)
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | 3M CP2 Press-Fit Socket 2 mm Type B |
| Signal Contact Quantities | 95, 110, 125 |
| Basic System Unit | 25 mm |
| Module Size | 50 mm |
| Mating Force | ≤ 0.75 N/PIN |
| Withdrawal Force | ≥ 0.15 N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70C (with all contacts powered) |
| Contact Resistance | ≤ 20 mΩ |
| Insulation Resistance | ≥ 10,000 MΩ |
| Test Voltage | 750 VACRMS |
| Temperature Rating | -55°C to +125°C |
| Recommended PCB Plated Through Hole Diameter | Ø 0.6±0.05 mm |
| Drill Hole Diameter | Ø 0.7±0.02 mm |
| PCB Thickness | 1.4 - 4.2 mm |
| Press-In Force | ≤ 204 N/pin (on nominal hole diameter) |
| Retention Force | ≥ 13.5 N/pin (on nominal hole diameter) |
| Shield Options | G= Upper Shield, Blank= No Shield |
| Plating Option FJ Details | 10~20 µ" Gold Contact Area, 100~200 µ" Matte Tin, 50~80 µ" Nickel Underplate |
| Plating Option KR Details | 30~40 µ" Gold Contact Area, 100~200 µ" Matte Tin, 50~80 µ" Nickel Underplate |
2411261605_3M-CP2-SB110-G1-FJ_C3649839.pdf
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