SMT connector 3M SPD08-020-L-RB-TR offering flexible stack heights and high speed data transfer capabilities
Product Overview
The 3M High-Speed Card-Edge Connector SPD08 is a high-density, 0.80mm pitch SMT BM socket designed for board-to-board (B-T-B) and wire-to-board (W-T-B) applications. It offers high-speed signal transmission performance up to 15 Gbps for B-T-B and 20 Gbps for W-T-B connections. The connector features flexible stack heights ranging from 16 mm to 40 mm and robust tolerance for misalignment. It is constructed with high-temperature LCP resin for plastic housing, capable of withstanding 260 C lead-free SMT processes. Applications include base stations, servers, hubs, switches, and routers.
Product Attributes
- Brand: 3M
- Product Line: High-Speed Card-Edge Connector SPD08
- Material (Housing): High temp LCP resin
- Pitch: 0.80mm
Technical Specifications
| Specification | Details |
|---|---|
| Signal Speed (B-T-B) | Up to 15 Gbps |
| Signal Speed (W-T-B) | Up to 20 Gbps |
| Stack Height | 16 mm to 40 mm |
| Misalignment Tolerance (X, Y) | +/- 0.8 mm |
| Misalignment Tolerance (Z) | +/- 1.0 mm (at 30 mm stack height) |
| Current Carrying Capacity (Single Pin) | Up to 3.0A |
| Current Rating (Fully Loaded) | 0.5 A |
| SMT Compatibility | Withstand 260 C lead-free SMT |
| Mating Card Thickness | 1.57 +/- 0.16 mm |
| Insertion Force (Mated with 1.57mm card) | Average 0.40 N/Pin |
| Number of Positions | 020, 040, 060, 064, 080, 100, 120, 140, 160, 180, 200 (Note: All positions are not tooled) |
| Latching Option | W/O LATCH (Blank), WITH LATCH (L) |
| Packaging Option | TRAY (Blank), TAPE & REEL (TR) |
| Plating Option | 0.76um GOLD (RB), 0.25um GOLD (RA) |
2412091214_3M-SPD08-020-L-RB-TR_C6818890.pdf