Industrial wire to board connector 3M 3448 45112 with 127 millimeter pitch and durable plating options
3M Ribbon Cable Socket and Header, 451 and 452 Series, 1.27mm (0.050") Pitch
Product Overview
This document details the product specifications for the 3M Ribbon Cable Wiremount Socket Assembly, 451 Series and the 3M Shrouded Boardmount Header Latch and Eject, 452 Series. These connectors are designed for wire-to-board applications with a 1.27mm (0.050") pitch. They are constructed with durable materials and offer various plating options for reliable electrical performance. The series is suitable for a wide operating temperature range and has undergone rigorous testing to ensure performance in demanding environments.
Product Attributes
- Brand: 3M
- Series: 451 Series (Wiremount Socket Assembly), 452 Series (Shrouded Boardmount Header Latch and Eject)
- Pitch: 1.27mm (0.050")
- Agency Listings: Underwriters Laboratories (UL), CUL
- Insulation Materials: Glass filled PBT (Socket), Glass filled LCP (Header)
- Contact Material: BeCu (Socket), Phosphor Bronze (Header)
- Strain Relief Material: Stainless Steel
Technical Specifications
| Specification | Value / Limit | Units | Requirement / Conditions | Test Standard / Method |
|---|---|---|---|---|
| Temperature Range (EIA) | -65 to +125 | C | ||
| Insulation Resistance | >1 x 109 | at 500 VDC | ||
| Current per EIA-364-70 (4-30 poles) | 0.75 | A | All contacts powered, 30C max temp rise | Method 2 |
| 1.50 | A | 6 contacts powered, 30C max temp rise | Method 2 | |
| Current per EIA-364-70 (32-50 poles) | 0.75 | A | All contacts powered, 30C max temp rise | Method 2 |
| 1.50 | A | 6 contacts powered, 30C max temp rise | Method 2 | |
| UL Ratings (4-50 poles) | Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 1.0 A | |||
| CUL Ratings (4-30 poles) | Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 1.0 A | |||
| CUL Ratings (32-50 poles) | Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 0.75 A | |||
| Voltage Rating | 125 | Vdc/ac (peak) | ||
| Dielectric Withstanding Voltage | 1250 | VDC | 1 min duration, no disruptive discharge | EIA-364-20 Method A Test Condition I |
| Dielectric Breakdown Voltage | 1250 | VDC | Ramp at 500V/s | EIA-364-20 Method A Test Condition I |
| Low Level Connection Resistance (LLCR) | <10 or <30 | mOhm | Max R per mated interface | EIA-364-23 |
| Header Pin Retention | 4.5 (MIN) | N | Average/pin | EIA-364-29 |
| Vibration | 3.10 | g | No discontinuities >10ns, max 10mOhm R | EIA-364-28 Condition VII Letter D / IEC-60512-6d-2e-6c |
| Mechanical Shock | 30 | g | No discontinuities >10ns, max 10mOhm R | EIA-364-27 Test Condition H / A |
| Durability (Full) | 100 (30" Au, 4-30p) / 25 (30" Au, 32-50p) / 20 (Flash Au) | Mating Cycles | Max 10mOhm R | EIA-364-13 |
| Durability (Preconditioning) | 50 (4-30p) / 25 (32-50p) | Mating Cycles | Max 10mOhm R (30"Au only) | EIA-364-13 |
| Mating Force / Contact | 1.25 (MAX) | N | Connector average/pin | EIA-364-13 Method B |
| Unmating Force / Contact | 0.4 (MIN) | N | Connector average/pin | EIA-364-18 |
| Plating Thickness (Tin) | 5.08-10.2 (200-400) | m (") | Random measurements | EIA-364-48 Method C |
| Plating Thickness (Nickel) | 1.27-3.81 (50-150) | m (") | Random measurements | |
| Plating Thickness (Gold) | 0.76 min (30) | m (") | Minimum random measurements | |
| Solderability (Header) | 95% | Coverage | As-received hours | EIA-364-52 |
| Temperature Life (Full) | 1008 | hours C | No physical abnormalities, max 30mOhm R | EIA-364-17 Method A Condition 5D |
| Thermal Shock | -65 to +125 | C | No physical abnormalities, max 10mOhm R | EIA-364-32, Table 2, Condition II |
| Moisture Sensitivity Level (Header) | Level 1 | 260 C, no defects, maintain dimensional stability | J-STD-020E | |
| Mixed Flowing Gas | 336 | hours | Tested on 30pin, 0.76 m (30 ") plating | EIA-364-65B Class IIA |
| Humidity Temperature Cycling | 10 | Days | No physical abnormalities, max 10mOhm R | EIA-364-31, Method III |
2411220419_3M-3448-45112_C17248011.pdf