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Industrial wire to board connector 3M 3448 45112 with 127 millimeter pitch and durable plating options

Manufacturer:
3M
Description:
Circular Connector Accessories RoHS
Category:
Circular Connector Accessories/Circular Connector Accessories
Specifications
Mfr. Part #:
3448-45112
Model Number:
3448-45112
Introduction

3M Ribbon Cable Socket and Header, 451 and 452 Series, 1.27mm (0.050") Pitch

Product Overview
This document details the product specifications for the 3M Ribbon Cable Wiremount Socket Assembly, 451 Series and the 3M Shrouded Boardmount Header Latch and Eject, 452 Series. These connectors are designed for wire-to-board applications with a 1.27mm (0.050") pitch. They are constructed with durable materials and offer various plating options for reliable electrical performance. The series is suitable for a wide operating temperature range and has undergone rigorous testing to ensure performance in demanding environments.

Product Attributes

  • Brand: 3M
  • Series: 451 Series (Wiremount Socket Assembly), 452 Series (Shrouded Boardmount Header Latch and Eject)
  • Pitch: 1.27mm (0.050")
  • Agency Listings: Underwriters Laboratories (UL), CUL
  • Insulation Materials: Glass filled PBT (Socket), Glass filled LCP (Header)
  • Contact Material: BeCu (Socket), Phosphor Bronze (Header)
  • Strain Relief Material: Stainless Steel

Technical Specifications

Specification Value / Limit Units Requirement / Conditions Test Standard / Method
Temperature Range (EIA) -65 to +125 C
Insulation Resistance >1 x 109 at 500 VDC
Current per EIA-364-70 (4-30 poles) 0.75 A All contacts powered, 30C max temp rise Method 2
1.50 A 6 contacts powered, 30C max temp rise Method 2
Current per EIA-364-70 (32-50 poles) 0.75 A All contacts powered, 30C max temp rise Method 2
1.50 A 6 contacts powered, 30C max temp rise Method 2
UL Ratings (4-50 poles) Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 1.0 A
CUL Ratings (4-30 poles) Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 1.0 A
CUL Ratings (32-50 poles) Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 0.75 A
Voltage Rating 125 Vdc/ac (peak)
Dielectric Withstanding Voltage 1250 VDC 1 min duration, no disruptive discharge EIA-364-20 Method A Test Condition I
Dielectric Breakdown Voltage 1250 VDC Ramp at 500V/s EIA-364-20 Method A Test Condition I
Low Level Connection Resistance (LLCR) <10 or <30 mOhm Max R per mated interface EIA-364-23
Header Pin Retention 4.5 (MIN) N Average/pin EIA-364-29
Vibration 3.10 g No discontinuities >10ns, max 10mOhm R EIA-364-28 Condition VII Letter D / IEC-60512-6d-2e-6c
Mechanical Shock 30 g No discontinuities >10ns, max 10mOhm R EIA-364-27 Test Condition H / A
Durability (Full) 100 (30" Au, 4-30p) / 25 (30" Au, 32-50p) / 20 (Flash Au) Mating Cycles Max 10mOhm R EIA-364-13
Durability (Preconditioning) 50 (4-30p) / 25 (32-50p) Mating Cycles Max 10mOhm R (30"Au only) EIA-364-13
Mating Force / Contact 1.25 (MAX) N Connector average/pin EIA-364-13 Method B
Unmating Force / Contact 0.4 (MIN) N Connector average/pin EIA-364-18
Plating Thickness (Tin) 5.08-10.2 (200-400) m (") Random measurements EIA-364-48 Method C
Plating Thickness (Nickel) 1.27-3.81 (50-150) m (") Random measurements
Plating Thickness (Gold) 0.76 min (30) m (") Minimum random measurements
Solderability (Header) 95% Coverage As-received hours EIA-364-52
Temperature Life (Full) 1008 hours C No physical abnormalities, max 30mOhm R EIA-364-17 Method A Condition 5D
Thermal Shock -65 to +125 C No physical abnormalities, max 10mOhm R EIA-364-32, Table 2, Condition II
Moisture Sensitivity Level (Header) Level 1 260 C, no defects, maintain dimensional stability J-STD-020E
Mixed Flowing Gas 336 hours Tested on 30pin, 0.76 m (30 ") plating EIA-364-65B Class IIA
Humidity Temperature Cycling 10 Days No physical abnormalities, max 10mOhm R EIA-364-31, Method III

2411220419_3M-3448-45112_C17248011.pdf
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