High temperature thermoplastic right angle press fit socket 3M CP2-SAB110-G1-KR with 2 mm grid spacing
Manufacturer:
3M
Description:
Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Mfr. Part #:
CP2-SAB110-G1-KR
Model Number:
CP2-SAB110-G1-KR
Introduction
Product Overview
The 3M CP2 Press-Fit Socket, 2 mm Type B, is designed for high signal density applications, offering a 25 mm basic system unit and 50 mm module. Compliant with IEC 61076-4-101 and IEC 60352-5 Standards, this right-angle socket features a 2 mm grid spacing for cost-effective high signal density. Its Eye of the Needle compliant pin press-fit design streamlines manufacturing. An optional grounding row enhances ground bounce and EMI immunity. This socket mates with 5-row 3M HM and CP2 Headers and is end-to-end stackable with various 5-row 3M sockets. It is suitable for applications requiring robust interconnect solutions and is not intended for stand-alone use.
Product Attributes
- Brand: 3M
- Product Series: CP2 Series
- Type: Press-Fit Socket
- Grid Spacing: 2 mm
- Contact Type: Signal Contacts
- Configuration: Right Angle
- Insulation Material: High Temperature Thermoplastic (LCP)
- Contact Material: Copper Alloy
- Flammability Rating: UL94V-0
- Compliance: IEC 61076-4-101, IEC 60352-5 Standards
- Origin: Printed in USA
Technical Specifications
| Specification | Details |
|---|---|
| Basic System Unit | 25 mm |
| Module Size | 50 mm |
| Signal Contact Quantities | 95, 110, 125 |
| Dimension A (95 Contacts) | 38.00 mm |
| Dimension B (95 Contacts) | 36.00 mm |
| Dimension A (110 Contacts) | 44.00 mm |
| Dimension B (110 Contacts) | 42.00 mm |
| Dimension A (125 Contacts) | 50.00 mm |
| Dimension B (125 Contacts) | 48.00 mm |
| Mating Force | ≤ 0.75 N/PIN |
| Withdrawal Force | ≥ 0.15 N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70°C (with all contacts powered) |
| Contact Resistance | ≤ 20 mΩ |
| Insulation Resistance | ≥ 10,000 MΩ |
| Test Voltage | 750 VACRMS |
| Temperature Rating | -55°C to +125°C |
| Recommended PCB Plated Through Hole Diameter | Ø 0.6 ± 0.05 mm |
| Drill Hole Diameter | Ø 0.7 ± 0.02 mm |
| PCB Thickness | 1.4 - 4.2 mm |
| Press-In Force | ≤ 204 N/pin (on nominal hole diameter) |
| Retention Force | ≥ 13.5 N/pin (on nominal hole diameter) |
| Plating Option FJ (Contact Area) | 10~20 µ" Gold |
| Plating Option FJ (Tin) | 100~200 µ" Matte Tin |
| Plating Option FJ (Nickel) | 50~80 µ" Nickel Underplate |
| Plating Option KR (Contact Area) | 30~40 µ" Gold |
| Plating Option KR (Tin) | 100~200 µ" Matte Tin |
| Plating Option KR (Nickel) | 50~80 µ" Nickel Underplate |
| Shield Options | G = Upper Shield, Blank = No Shield |
2411261605_3M-CP2-SAB110-G1-KR_C3640361.pdf
Send RFQ
Stock:
MOQ:
