interconnect solution 3M 929870-01-17-30 low profile socket with copper alloy contact and tuning fork design
Product Overview
The 3M Boardmount Socket 929 Series is a low-profile, straight solder tail socket designed for reliable interconnect solutions. Featuring a tuning fork contact design and solder stand-offs for efficient wave soldering, this socket offers a compact solution for board stacking with a minimum clearance of .150". It is suitable for applications requiring a current rating of 1A and operates within a temperature range of -40C to 105C.
Product Attributes
- Brand: 3M
- Series: 929 Series
- Contact Design: Tuning fork
- Insulation Material: Glass Filled Polyester (PBT) or High Temperature Nylon
- Flammability: UL 94V-0
- Color: Black
- Contact Material: Copper Alloy
- Underplating: 100 [ 2.54 m ] Nickel
- Marking: None
- Origin: 3M Interconnect Solutions
Technical Specifications
| Specification | Details |
|---|---|
| Contact Pitch | .100 [ 2.54 ] |
| Profile | Low Profile |
| Solder Tails | Straight |
| Contact Quantity Options | 1-36 contacts |
| Current Rating | 1 A |
| Insulation Resistance | > 1 109 at 500 VDC |
| Withstanding Voltage | 1000 Vrms at Sea Level |
| Temperature Rating | -40C to 105C |
| Process Rating (High Temp Nylon) | 260C (single pass, per J-STD-020C) |
| Maximum Molded Insulator Temperature (PBT Insulator) | 191C (Solder Wave Process Only) |
| Board Stacking Clearance | As close as .150 |
| Plating Options (Wiping Area) | Gold, Tin Lead or Matte Tin (See ordering information) |
| Plating Options (Solder Tails) | Tin Lead or Matte Tin (See ordering information) |
| UL File No. | E68080 |
| Recommended Mating Header Pin Length | .101 [ 2.57 ] (Maximum) |
Note: Regulatory information regarding RoHS compliance is available in the provided documentation (Appendices E1-E4, C1-C2). Specific plating options and contact quantities are detailed in the ordering information.
2411041600_3M-929870-01-17-30_C20862755.pdf