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Compact and 3M 150208-2000-RB-WB Boardmount Socket Suitable for Various Electronic Interconnect Needs

Manufacturer:
3M
Description:
2mm 2mm 2 500V 8P Tin -55℃~+105℃ 1A Surface Mount,Vertical SMD,P=2mm Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Pitch:
2mm
Row Spacing:
2mm
Number Of Rows:
双排
Voltage Rating (Max):
500V
Number Of Pins:
8P
Contact Plating:
Operating Temperature:
-55℃~+105℃
Current Rating:
1A
Mounting Type:
立贴
Mfr. Part #:
150208-2000-RB-WB
Package:
SMD,P=2mm
Model Number:
150208-2000-RB-WB
Introduction

3M Boardmount Socket 1502 Series

Product Overview
The 3M Boardmount Socket 1502 Series offers a 2 mm x 2 mm pitch solution for straight surface mount, straight, and right-angle plated through-hole applications. Designed with a high-temperature insulator and reflow solder compatibility, these sockets minimize PCB stack height due to their low profile. They are end stackable, with through-hole versions also offering side stackability. Surface mount parts are available in tape and reel packaging with a vacuum cap for automated placement. This series is suitable for various electronic interconnect applications requiring reliable board-to-board connections.

Product Attributes

  • Brand: 3M
  • Series: 1502 Series
  • Pitch: 2 mm x 2 mm
  • Mounting Types: Straight Surface Mount, Straight Plated Through-Hole, Right Angle Plated Through-Hole
  • Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical Thru-Hole, Right Angle Thru-Hole)
  • Contact Material: Copper alloy
  • Plating (Wiping Area): 0.76 m [30 ] Gold
  • Plating (Underplating): 1.27-3.8 1 m [50-150 ] Nickel overall
  • Plating (Solder Tails): 5.1 m [200 ] Matte tin or tin-lead
  • Temperature Rating: -55C to +105C
  • Process Rating: Maximum 260C (per J-STD-020C)
  • Moisture Sensitivity Level: 1 (per J-STD-020C)
  • Certifications: UL File No.: E68080
  • RoHS Compliance: Refer to Regulatory Information Appendix (RIA) E1 & C1 apply

Technical Specifications

Specification Details
Current Rating 1 A
Insulation Resistance > 1 109 at 250 VDC
Withstanding Voltage 500 VDC at Sea Level
Contact Quantity (Dimension A) 04 to 60 (See Table 1 for specific dimensions)
Tape Width (for SMT) 24 mm WB, 44 mm WD, 56 mm WE, 72 mm WF, 88 mm WG (See Table 1)
Board Location Post 0 = None (Standard), 2 = With board location post (Special order)
Plating Suffix RB = 0.76 m [30 ] Gold with matte tin solder tails (RIA E1 & C1 apply)
TB = 0.76 m [30 ] Gold with tin-lead solder tails (RIA E3 & C2 apply)
Packaging Style Blank = tray packaging
WX = tape & reel pkg
Solder Tail Length (Dimension B) 1 = 1.4 mm (Special order)
2 = 2.54 mm (Standard)
Standoff Height Code (Dimension B) 0 = 0.38 mm (Standard)
1 = 1.35 mm (Special order)
2 = 0.71 mm (Special order - Avail. for 40, 44 and 50 position only)

Note: Dimensions for reference only.


2410311323_3M-150208-2000-RB-WB_C7163799.pdf
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