PCB stacking connector 3M 150224-6002-RB with 2 mm pitch straight surface mount and plated through-hole options
Manufacturer:
3M
Description:
2mm 2mm 2 500V 24P Tin -55℃~+105℃ 1A Through Hole Through Hole,P=2mm Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Pitch:
2mm
Row Spacing:
2mm
Number Of Rows:
双排
Voltage Rating (Max):
500V
Number Of Pins:
24P
Contact Plating:
锡
Operating Temperature:
-55℃~+105℃
Current Rating:
1A
Mounting Type:
直插
Mfr. Part #:
150224-6002-RB
Package:
Through Hole,P=2mm
Model Number:
150224-6002-RB
Introduction
Product Overview
The 3M Boardmount Socket 1502 Series offers a 2 mm x 2 mm pitch for straight surface mount, straight, and right-angle plated through-hole applications. These high-temperature, reflow solder compatible sockets are designed for efficient PCB stacking with low height profiles. They are end stackable, with through-hole versions also being side stackable. Surface mount parts are available in tape and reel packaging with a vacuum cap for automated placement. These connectors are suitable for applications requiring reliable interconnectivity and high-temperature processing.
Product Attributes
- Brand: 3M
- Series: 1502 Series
- Pitch: 2 mm x 2 mm
- Mounting Type: Straight Surface Mount, Straight Plated Through-Hole, Right Angle Plated Through-Hole
- Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical Thru-Hole, Right Angle Thru-Hole)
- Contact Material: Copper alloy
- Plating (Wiping Area): 0.76 m [30 ] Gold
- Plating (Underplating): 1.27-3.81 m [50-150 ] Nickel overall
- Plating (Solder Tails): 5.1 m [200 ] Matte tin or tin-lead
- Temperature Rating: -55C to +105C
- Process Rating: Maximum 260C (per J-STD-020C)
- Moisture Sensitivity Level: 1 (per J-STD-020C)
- Certifications: UL File No.: E68080
- Regulatory Information: RIA E1 & C1 apply (RoHS compliance)
Technical Specifications
| Specification | Value |
|---|---|
| Current Rating | 1 A |
| Insulation Resistance | > 1 109 at 250 VDC |
| Withstanding Voltage | 500 VDC at Sea Level |
| Contact Quantity (Example) | 04, 06, 08, ..., 60 (See Table 1 for details) |
| Dimension A (Example) | 3.96 [0.156] to 59.87 [2.357] (See Table 1 for details) |
| Tape Width (for SMT) | 24 mm WB, 44 mm WD, 56 mm WE, 72 mm WF, 88 mm WG (See Table 1 for details) |
| Board Location Post Option | 0 = None (Standard), 2 = With board location post (Special order) |
| Plating Suffix (Gold with Matte Tin) | RB (0.76 m [30 ] Gold with matte tin solder tails) |
| Plating Suffix (Gold with Tin-Lead) | TB (0.76 m [30 ] Gold with tin-lead solder tails) |
| Packaging Style | Tray packaging (Blank), Tape & reel pkg (WX) |
| Solder Tail Length Dimension B (Example) | 1 = 1.4 mm (Special order), 2 = 2.54 mm (Standard) |
| Standoff Height Code (Example) | 0 = 0.38 mm (Standard), 1 = 1.135 mm (Special order), 2 = 0.71 mm (Special order - for 40, 44, 50 positions only) |
| Standoff Height Dimension B (Code 0) | 0.015 [0.38] |
| Standoff Height Dimension C (Code 0) | .065 [1.65] |
| Standoff Height Dimension D (Code 0) | .179 [4.55] |
| Standoff Height Dimension E (Code 0) | .100 [2.54] |
| Standoff Height Dimension F (Code 0) | .040 [1.02] |
2410311323_3M-150224-6002-RB_C6041992.pdf
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