Surfacemount Chip Carrier Socket 3M 8468-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Devices
Product Overview
The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are suitable for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available. These sockets are RoHS Compliant.
Product Attributes
- Brand: 3M
- Product Line: 3M Chip Carrier Sockets
- Series: 8400 Series
- Mounting Type: Surfacemount
- Insulation Material: Glass Filled Polyphenylene Sulfide (PPS)
- Insulator Flammability: UL 94V-0
- Insulator Color: Black
- Contact Material: Copper Alloy
- Plating Underplating: 50 " [ 1.27 m ] Nickel
- Plating Wiping Area: 160 ", [ 4.06 m ] Matte Tin
- Certifications: RoHS Compliant (RIA E1 and C1 apply)
- Alignment Feature (Tube Packaging): With Location Post (A), Without Location Post (B)
- Packaging: Tube Pack (TP), Tape and Reel (TR)
Technical Specifications
| Specification | Value |
|---|---|
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Maximum 260C, single pass (profile per J-STD-020C) |
| Moisture Sensitivity Level | 1 (per J-STD-020C) |
Model Dimensions (mm [Inch])
| Contact Quantity | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| 20 | 15.65 [0.616] | 15.65 [0.616] | 5.08 [0.200] | 5.08 [0.200] | 10.03 [0.395] | 10.03 [0.395] | 12.70 [0.500] | 6.35 [0.250] |
| 28 | 18.18 [0.716] | 18.18 [0.716] | 7.62 [0.300] | 7.62 [0.300] | 12.57 [0.495] | 12.57 [0.495] | 15.24 [0.600] | 7.62 [0.300] |
| 32 | 18.18 [0.716] | 20.75 [0.817] | 7.62 [0.300] | 10.16 [0.400] | 12.57 [0.495] | 15.11 [0.595] | 17.78 [0.700] | 7.62 [0.300] |
| 44 | 23.28 [0.917] | 23.28 [0.917] | 12.70 [0.500] | 12.70 [0.500] | 17.65 [0.695] | 17.65 [0.695] | 20.32 [0.800] | 10.16 [0.400] |
| 52 | 25.84 [1.017] | 25.84 [1.017] | 15.24 [0.600] | 15.24 [0.600] | 20.19 [0.795] | 20.19 [0.795] | 22.86 [0.900] | 11.43 [0.450] |
| 68 | 30.95 [1.219] | 30.95 [1.219] | 20.32 [0.800] | 20.32 [0.800] | 25.27 [0.995] | 25.27 [0.995] | 27.94 [1.100] | 13.97 [0.550] |
| 84 | 36.00 [1.417] | 36.00 [1.417] | 25.40 [1.000] | 25.40 [1.000] | 30.35 [1.195] | 30.35 [1.195] | 33.02 [1.300] | 16.51 [0.650] |
Notice: 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Tin whiskers are an inherent characteristic of tin, and mechanically stressing the tin is a known driver of whisker growth. It is possible the PLCC and PLCC socket may exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Consider whether a PLCC socket is suitable for your particular needs after considering your product applications life span and environment, including mechanical stresses, humidity, and thermal cycling, all of which have been shown to stimulate tin whisker growth.
2410121845_3M-8468-21A1-RK-TP_C5529347.pdf
