Chip Carrier Socket Surfacemount 3M 8444-21B1-RK-TP Compatible with JEDEC MO-047 and MO-052 Devices
Product Overview
The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are compatible with automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available, and the product is RoHS Compliant.
Product Attributes
- Brand: 3M
- Series: 8400 Series
- Insulation Material: Glass Filled Polyphenylene Sulfide (PPS)
- Flammability: UL 94V-0
- Color: Black
- Contact Material: Copper Alloy
- Underplating: 50 " [ 1.27 m ] Nickel
- Overall Wiping Area Plating: 160 ", [ 4.06 m ] Matte Tin
- Certifications: RoHS Compliant (RIA E1 and C1 apply)
- Moisture Sensitivity Level: 1 (per J-STD-020C)
- Packaging Options: Tube Pack (TP), Tape and Reel (TR)
Technical Specifications
| Specification | Value |
|---|---|
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Maximum 260C, single pass (profile per J-STD-020C) |
Model & Dimension Data
| Contact Quantity | A (mm/in) | B (mm/in) | C (mm/in) | D (mm/in) | E (mm/in) | F (mm/in) | G (mm/in) | H (mm/in) | Alignment Feature |
|---|---|---|---|---|---|---|---|---|---|
| 20 | 15.65 [0.616] | 15.65 [0.616] | 5.08 [0.200] | 5.08 [0.200] | 10.03 [0.395] | 10.03 [0.395] | 12.70 [0.500] | 6.35 [0.250] | A = With Location Post (tube packaging only) / B = Without Location Post |
| 28 | 18.18 [0.716] | 18.18 [0.716] | 7.62 [0.300] | 7.62 [0.300] | 12.57 [0.495] | 12.57 [0.495] | 15.24 [0.600] | 7.62 [0.300] | A = With Location Post (tube packaging only) / B = Without Location Post |
| 32 | 18.18 [0.716] | 20.75 [0.817] | 7.62 [0.300] | 10.16 [0.400] | 12.57 [0.495] | 15.11 [0.595] | 17.78 [0.700] | 7.62 [0.300] | A = With Location Post (tube packaging only) / B = Without Location Post |
| 44 | 23.28 [0.917] | 23.28 [0.917] | 12.70 [0.500] | 12.70 [0.500] | 17.65 [0.695] | 17.65 [0.695] | 20.32 [0.800] | 10.16 [0.400] | A = With Location Post (tube packaging only) / B = Without Location Post |
| 52 | 25.84 [1.017] | 25.84 [1.017] | 15.24 [0.600] | 15.24 [0.600] | 20.19 [0.795] | 20.19 [0.795] | 22.86 [0.900] | 11.43 [0.450] | A = With Location Post (tube packaging only) / B = Without Location Post |
| 68 | 30.95 [1.219] | 30.95 [1.219] | 20.32 [0.800] | 20.32 [0.800] | 25.27 [0.995] | 25.27 [0.995] | 27.94 [1.100] | 13.97 [0.550] | A = With Location Post (tube packaging only) / B = Without Location Post |
| 84 | 36.00 [1.417] | 36.00 [1.417] | 25.40 [1.000] | 25.40 [1.000] | 30.35 [1.195] | 30.35 [1.195] | 33.02 [1.300] | 16.51 [0.650] | A = With Location Post (tube packaging only) / B = Without Location Post |
Note: For Tape and Reel Packaging dimensions, contact 3M customer service or your preferred 3M distributor.
Dimensions in mm (Inch) with tolerance .3 for .0, .20 for .00 unless noted. Dimensions in [ ] are for reference only.
Important Notice: 3M PLCC products are tin plated on the contact wiping surface to ensure mated reliability. Tin whiskers are an inherent characteristic of tin, and mechanical stressing can drive whisker growth. It is possible for the PLCC and PLCC socket to exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations with whisker mitigating tin plating chemistry to reduce the likelihood of growth. Consider suitability for your application's lifespan, environment, mechanical stresses, humidity, and thermal cycling.
2410121845_3M-8444-21B1-RK-TP_C5121464.pdf
