Compact Low Profile 3M 150226-2020-RB-WD Boardmount Socket 2mm Pitch with Gold Plated Contact Area
Product Overview
The 3M Boardmount Socket 1502 Series offers a 2 mm x 2 mm pitch for straight surface mount, straight, and right-angle plated through-hole applications. Designed with a high-temperature insulator and reflow solder compatibility, these sockets minimize PCB stack height due to their low profile. They are end stackable, with through-hole versions also being side stackable. Surface mount parts are available in tape and reel packaging with a vacuum cap for automated placement. These sockets are suitable for applications requiring current ratings of 1 A and feature gold plating on the wiping area for reliable connections.
Product Attributes
- Brand: 3M
- Series: 1502 Series
- Pitch: 2 mm x 2 mm
- Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical Thru-Hole, Right Angle Thru-Hole)
- Contact Material: Copper alloy
- Plating (Underplating): Nickel
- Plating (Wiping Area): Gold
- Plating (Solder Tails): Matte tin or tin-lead
- Marking: Orientation delta and 3M Logo (except surface mount)
- Certifications: UL File No.: E68080
- RoHS Compliance: RIA E1 & C1 apply (refer to www.3mconnector.com for details)
Technical Specifications
| Specification | Details | ||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Physical Dimensions | Dimension A (Contact Quantity): Varies by contact quantity (e.g., 3.96 mm [0.156] for 04 contacts, up to 59.87 mm [2.357] for 60 contacts) | ||||||||||||||||||||||||
| Contact Plating | Underplating: 1.27-3.8 1 m [50-150 ] Nickel overall Wiping Area: 0.76 m [30 ] Gold Solder Tails: 5.1 m [200 ] Matte tin or tin-lead | ||||||||||||||||||||||||
| Electrical Specifications | Current Rating: 1 A Insulation Resistance: > 1 109 at 250 VDC Withstanding Voltage: 500 VDC at Sea Level | ||||||||||||||||||||||||
| Environmental Specifications | Temperature Rating: -55C to +105C Process Rating: Maximum 260C (per J-STD-020C) Moisture Sensitivity Level: 1 (per J-STD-020C) | ||||||||||||||||||||||||
| Ordering Information - General | Part Number Structure: 1502XX-XXX-XX Number of positions (See Table 1) Board Location Post: 0 = None (Standard), 2 = With board location post (Special order) Plating Suffix: RB = 0.76 m [30 ] Gold with matte tin solder tails; TB = 0.76 m [30 ] Gold with tin-lead solder tails Packaging Style: Blank = tray packaging; WX = tape & reel pkg | ||||||||||||||||||||||||
| Ordering Information - Solder Tail Length | Part Number Structure: 1502XX-600X-XX Number of positions (See Table 1) Solder Tail Length Dimension B: 1 = 1.4 mm (Special order); 2 = 2.54 mm (Standard) | ||||||||||||||||||||||||
| Ordering Information - Standoff Height | Part Number Structure: 1502XX-5XX2-XX Number of positions (See Table 1) Standoff Height Code (Dimension B): 0 = 0.38 mm (Standard); 1 = 1.135 mm (Special order); 2 = 0.71 mm (Special order - Avail. for 40, 44 and 50 position only) | ||||||||||||||||||||||||
| Table 2 Standoff Height Dimensions |
| ||||||||||||||||||||||||
| Tolerances | Unless Noted: 0.127 mm [ 0.005 in], 2.54 mm [ 0.100 in], 0.254 mm [ 0.010 in] |
2410311323_3M-150226-2020-RB-WD_C20506147.pdf