Compact 3M 150210-2000-RB boardmount socket supporting both straight and right angle mounting styles
Manufacturer:
3M
Description:
Female Header 10 Position 2mm Pitch Dual Row Surface Mount -55℃~+105℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Pitch:
2mm
Row Spacing:
2mm
Number Of Rows:
双排
Voltage Rating (Max):
500V
Number Of Pins:
10P
Contact Plating:
锡
Operating Temperature:
-55℃~+105℃
Current Rating:
1A
Mounting Type:
立贴
Mfr. Part #:
150210-2000-RB
Package:
SMD,P=2mm
Model Number:
150210-2000-RB
Introduction
Product Overview
The 3M Boardmount Socket 1502 Series offers versatile interconnect solutions with 2 mm x 2 mm pitch. Designed for high-temperature applications, these sockets are reflow solder compatible and feature a low profile to minimize PCB stack height. Available in straight surface mount, and straight and right-angle plated through-hole configurations, they support both end and side stackability. SMT versions are provided in tape and reel packaging with vacuum caps for automated placement. This series is ideal for various electronic interconnect applications requiring reliable and compact board-to-board connections.
Product Attributes
- Brand: 3M
- Series: 1502 Series
- Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical Thru-Hole, Right Angle Thru-Hole)
- Contact Material: Copper alloy
- Plating (Underplating): Nickel
- Plating (Wiping Area): Gold
- Plating (Solder Tails): Matte tin or tin-lead
- Marking: Orientation delta and 3M Logo (except surface mount)
- UL File No.: E68080
- Regulatory Information: RIA E1 & C1 apply (for compliance information, refer to www.3mconnector.com)
Technical Specifications
| Specification | Details |
|---|---|
| Pitch | 2 mm x 2 mm |
| Insulator Type | High Temperature |
| Mounting Type | Surface Mount, Plated Through-Hole (Straight and Right Angle) |
| Stackability | End Stackable (all), Side Stackable (Thru-hole versions) |
| Solder Compatibility | Reflow Solder Compatible |
| Contact Plating (Nickel Underplating) | 1.27-3.8 m [50-150 ] |
| Contact Plating (Gold Wiping Area) | 0.76 m [30 ] |
| Contact Plating (Solder Tails) | 5.1 m [200 ] Matte tin or 0.76 m [30 ] Gold (with matte tin or tin-lead solder tails) |
| Current Rating | 1 A |
| Insulation Resistance | > 1 109 at 250 VDC |
| Withstanding Voltage | 500 VDC at Sea Level |
| Temperature Rating | -55C to +105C |
| Process Temperature Rating | Maximum 260C (per J-STD-020C) |
| Moisture Sensitivity Level | 1 (per J-STD-020C) |
| Board Location Post | Optional (0 = None, 2 = With board location post) |
| Plating Suffix | RB = 0.76 m [30 ] Gold with matte tin solder tails; TB = 0.76 m [30 ] Gold with tin-lead solder tails |
| Packaging Style | Tray packaging or Tape & Reel (WX) |
| Date Modified | July 5, 2010 |
Note: Dimensions are for reference only.
2410311323_3M-150210-2000-RB_C6976688.pdf
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